Novel packaging technology for high-g MEMS accelerometer

Xin Quan Jiao, Jia Bin Chen*, Jing Yuan Yin, Ding Meng

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

Standard IC (Integrated Circuit) package has been adopted in traditional system-level packaging of MEMS devices, such as plastic packages, shell packages of ceramic and shell packages of TO metal. Ceramic shell is easily broken due to the causes such as: the impact of high-g sensors is relatively high; large residual stress remains after thermoplastic encapsulation; shell of TO series is too large and pin is easily broken under the impact of more than 5 × 103g owing to the line installation. In response, this paper presents a new package method for MEMS accelerometer, which adopts glass-silicon-glass structure at wafer level and introduces an aluminum shell filled with two-component epoxy resin at system level. There are many advantages of the accelerometer after package, such as small volume, strong sealing, little residual stress, high-impact resistance, good stability, and suitable for small batch production, etc.

Original languageEnglish
Pages (from-to)536-539
Number of pages4
JournalZhongguo Guanxing Jishu Xuebao/Journal of Chinese Inertial Technology
Volume21
Issue number4
Publication statusPublished - Aug 2013

Keywords

  • Accelerometer
  • Glass-silicon-glass structure
  • MEMS
  • Packaging

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Jiao, X. Q., Chen, J. B., Yin, J. Y., & Meng, D. (2013). Novel packaging technology for high-g MEMS accelerometer. Zhongguo Guanxing Jishu Xuebao/Journal of Chinese Inertial Technology, 21(4), 536-539.