Abstract
Standard IC (Integrated Circuit) package has been adopted in traditional system-level packaging of MEMS devices, such as plastic packages, shell packages of ceramic and shell packages of TO metal. Ceramic shell is easily broken due to the causes such as: the impact of high-g sensors is relatively high; large residual stress remains after thermoplastic encapsulation; shell of TO series is too large and pin is easily broken under the impact of more than 5 × 103g owing to the line installation. In response, this paper presents a new package method for MEMS accelerometer, which adopts glass-silicon-glass structure at wafer level and introduces an aluminum shell filled with two-component epoxy resin at system level. There are many advantages of the accelerometer after package, such as small volume, strong sealing, little residual stress, high-impact resistance, good stability, and suitable for small batch production, etc.
Original language | English |
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Pages (from-to) | 536-539 |
Number of pages | 4 |
Journal | Zhongguo Guanxing Jishu Xuebao/Journal of Chinese Inertial Technology |
Volume | 21 |
Issue number | 4 |
Publication status | Published - Aug 2013 |
Keywords
- Accelerometer
- Glass-silicon-glass structure
- MEMS
- Packaging