TY - GEN
T1 - Ni-doped Liquid Metal Printed Highly Stretchable and Conformable Strain Sensor for Multifunctional Human-Motion Monitoring
AU - Wang, Xuelin
AU - Guo, Rui
AU - Yuan, Bo
AU - Yao, Youyou
AU - Wang, Feng
AU - Liu, Jing
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/10/26
Y1 - 2018/10/26
N2 - A highly stretchable and conformable strain sensor fabricated by Ni-doped liquid metal (Ni-GaIn) is designed to record and reconstruct human motion at elbow, knee, heel and even fingers to realize multifunctional human-activity monitoring. The new electronic ink of Ni-GaIn is directly and rapidly printed onto luminous soft substrate to manufacture strain sensor with excellent stretchable and stable electrical properties. Composed of the Ni-GaIn sensors, multifunctional sensor system is demonstrated to work well as human-machine interface, which integrates various functions including measurement and reconstruction. This sensor system provides potential applications for quantifying human motion and is also critical for personal healthcare, prosthetic control and soft robotics in the near future.
AB - A highly stretchable and conformable strain sensor fabricated by Ni-doped liquid metal (Ni-GaIn) is designed to record and reconstruct human motion at elbow, knee, heel and even fingers to realize multifunctional human-activity monitoring. The new electronic ink of Ni-GaIn is directly and rapidly printed onto luminous soft substrate to manufacture strain sensor with excellent stretchable and stable electrical properties. Composed of the Ni-GaIn sensors, multifunctional sensor system is demonstrated to work well as human-machine interface, which integrates various functions including measurement and reconstruction. This sensor system provides potential applications for quantifying human motion and is also critical for personal healthcare, prosthetic control and soft robotics in the near future.
UR - http://www.scopus.com/inward/record.url?scp=85056630065&partnerID=8YFLogxK
U2 - 10.1109/EMBC.2018.8513060
DO - 10.1109/EMBC.2018.8513060
M3 - Conference contribution
C2 - 30441091
AN - SCOPUS:85056630065
T3 - Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
SP - 3276
EP - 3279
BT - 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2018
Y2 - 18 July 2018 through 21 July 2018
ER -