Modulating void action and residual stress variation of composite materials during curing process

Rong Guo Wang*, Qiu Tian, Wen You Ma, Cheng Qin Dai, Feng Tian, Yu Jin Chen, Chen Sha Li, Mao Sheng Cao

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

It is difficult to insure the quality of composites for the reason that there are complicated processes during the curing process of composites. Void action and residual stress act as the main actors of influencing the quality of composite products. In this paper, the formation principles of void and residual stress are analyzed. The process model is established. The computer code is made to calculate the void growth and the residual stress formation. The results of computation can be used as the base for the design of the composite curing process.

Original languageEnglish
Pages (from-to)95-101
Number of pages7
JournalFuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
Volume19
Issue number5
Publication statusPublished - Oct 2002
Externally publishedYes

Keywords

  • Composites
  • Cure
  • Residual stress
  • Void

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