Microstructural evolution and deformation mechanism of the 80W-20Cu alloy at ultra-high strain rates under explosive loading

Guo Wenqi, Liu Jinxu*, Li Shukui, Wang Yingchun, Ji Wei

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)

Abstract

The microstructural evolution and deformation mechanism of the 80. W-20Cu alloy at ultra-high strain rates under explosive loading were systematically investigated. During the deformation process, the W skeleton with high strength was fragmented into W particles, and the W particles were slightly elongated. The Cu matrix was severely deformed and significantly contributed to coordinating the deformation of the 80. W-20Cu alloy. Under ultra-high stain rate conditions, the deformation mechanism of the Cu matrix undergoes dynamic recrystallisation, a process in which dislocation movement plays a dominant role instead of twinning. A novel structure of high-density dislocation walls was found in the deformed Cu matrix. Analysis shows that under the conditions of ultra-high strain rate loading, high-density dislocation walls composed of parallel dislocation lines are generated in Cu grains that subsequently turn into large angular boundaries. Large angular boundaries ultimately transform into refined grain boundaries, and thus, grain refinement is accomplished.

Original languageEnglish
Pages (from-to)36-44
Number of pages9
JournalMaterials Science and Engineering: A
Volume572
DOIs
Publication statusPublished - 10 Jun 2013

Keywords

  • Dynamic recrystallisation
  • Grain refinement
  • Microstructural evolution
  • Ultra-high strain rate
  • W-Cu alloy

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