Microstress bonding design of low-distortion mirror assembly

To address the problem that bonding can lead to a reduction in the surface shape precision of a space-bound mirror, relationships between mirror deformation, thermal stress, and curing shrinkage stress were studied, and a bonding microstress design route was proposed. The thermal stress and thermal deformation introduced by thermal expansion mismatch were eliminated through an athermal adhesive layer thickness design. The relationship between mirror deformation and the curing shrinkage of the adhesive layer was derived completely, and structural optimization measures for releasing the curing stress of the adhesive layer are given. Bonding stress analysis was conducted based on the equivalent thermal deformation method, and an optimal structure meeting the design requirements was obtained. Finally, bonding of the mirror assembly was completed via this route, and the measured surface shape precision was stable at 0.0225λ. The theoretical analysis and experimental study demonstrate that this bonding design method can predict the bonding stress in the assembly process, making the follow-up bonding result controllable. These results should provide an excellent reference for the design and high-precision integration of large-Aperture mirrors.