@inproceedings{5e2214c020944f78898711636f728dd1,
title = "Metal film bridge with TSV-based 3D wafer level packaging",
abstract = "This paper presents the design and reliability research of a metal film bridge used TSV-based three-dimensional wafer level packaging (3DWLP). To compare with metal film bridge based on traditional wire bonding, the vertical TSV interconnects perform a variety of advantages such as shorter transmission length, lower power consumption, higher integrated structure and anti-overload ability. The structure is fabricated using special micro-nano fabrication technology, and its characterization is analyzed by numerical calculation and simulation. The calculation is based on the energy conservation law and the simulation use a software called COMSOL Multiphysics. The results of two methods show TSV-based metal film bridge is reliable under the impact of instantaneous large current.",
keywords = "3D wafer level packaging, Metal film bridge, TSV",
author = "Yunlong Guo and Wenzhong Lou and Xuran Ding",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015 ; Conference date: 07-04-2015 Through 11-04-2015",
year = "2015",
month = jul,
day = "1",
doi = "10.1109/NEMS.2015.7147460",
language = "English",
series = "2015 IEEE 10th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "430--434",
booktitle = "2015 IEEE 10th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015",
address = "United States",
}
