Investigation of diamond wheel topography in Elliptical Ultrasonic Assisted Grinding (EUAG) of monocrystal sapphire using fractal analysis method

Qiuyan Wang, Wenxiang Zhao, Zhiqiang Liang*, Xibin Wang, Tianfeng Zhou, Yongbo Wu, Li Jiao

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

30 Citations (Scopus)

Abstract

The wear behaviors of grinding wheel have significant influence on the work-surface topography. However, a comprehensive and quantitative method is lacking for evaluating the wear conditions of grinding wheel. In this paper, a fractal analysis method is used to investigate the wear behavior of resin-bonded diamond wheel in Elliptical Ultrasonic Assisted Grinding (EUAG) of monocrystal sapphire, and a series of experiments on EUAG and conventional grinding (CG) are performed. The results show that the fractal dimension of grinding wheel topography is highly correlated to the wear behavior, i.e., grain fracture, grain pullout, and wheel loading. An increase in cutting edge density on the wheel surface results in an increase of the fractal dimension, but an increase in the grain pullout and wheel loading results in a decrease in the fractal dimension. The wheel topography in EUAG has a higher fractal dimension than that in CG before 60 passes due to better self-sharpening behavior, and then has a smaller fractal dimension because of more serious wheel loadings after 60 passes. By angle-dependent distribution analysis of profile fractal dimensions, the wheel surface topography is transformed from isotropic to anisotropic. These indicated that the fractal analysis method could be further used in monitoring of a grinding wheel performance in EUAG.

Original languageEnglish
Pages (from-to)87-95
Number of pages9
JournalUltrasonics
Volume84
DOIs
Publication statusPublished - Mar 2018

Keywords

  • Elliptical ultrasonic assisted grinding
  • Fractal analysis
  • Micro fracture
  • Resin-bonded diamond wheel
  • Wear

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