Investigation into loose abrasive machining for silicon carbide

Reaction-bonded silicon carbide component with high hardness and complex crystal-phase structure imply the manufacturing of high precision very difficult. The present study focuses on the processes of loose abrasive manufacturing for silicon carbide. The characteristics of material removal, surface roughness and surface morphology in grinding and polishing of silicon carbide using different pads are reported, and how these factors are affected by process parameters such as the machining force, the rotation speed, abrasive type and size are also examined.