TY - GEN
T1 - Investigation for the response of PCB assembly with five POP packages during dropping
AU - Yu, Peng
AU - Fan, Zerui
AU - Yao, Xiaohu
PY - 2012
Y1 - 2012
N2 - The dropping for Portable electronic produce may cause solder joint failure of packages by our miss handling, which leads to malfunction of product. Therefore, the investigation of response of PCB assembly during dropping is very important to the development or improvement of the product. According to JEDEC standard, in this paper, the response of PCB assembly with five POP packages will be studied in detail by experimental and Finite Element Methods (FEM). The dynamic strain response at some key points of PCB will be tested in drop test, and verified the simulation model. The simulation of PCB assembly is performed by the large commercial finite element software ABAQUS and the stress responses of solder joints during dropping are obtained in the simulation.
AB - The dropping for Portable electronic produce may cause solder joint failure of packages by our miss handling, which leads to malfunction of product. Therefore, the investigation of response of PCB assembly during dropping is very important to the development or improvement of the product. According to JEDEC standard, in this paper, the response of PCB assembly with five POP packages will be studied in detail by experimental and Finite Element Methods (FEM). The dynamic strain response at some key points of PCB will be tested in drop test, and verified the simulation model. The simulation of PCB assembly is performed by the large commercial finite element software ABAQUS and the stress responses of solder joints during dropping are obtained in the simulation.
UR - http://www.scopus.com/inward/record.url?scp=84875437498&partnerID=8YFLogxK
U2 - 10.1109/ICEPT-HDP.2012.6474818
DO - 10.1109/ICEPT-HDP.2012.6474818
M3 - Conference contribution
AN - SCOPUS:84875437498
SN - 9781467316804
T3 - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
SP - 1180
EP - 1184
BT - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
Y2 - 13 August 2012 through 16 August 2012
ER -