@inproceedings{5e548a063f8d40e5ba43501a65155070,
title = "Integrated passive devices on through silicon interposer with re-distribution layers",
abstract = "This paper presents the design, integration and characterization of integrated passive devices (IPDs) on low cost through silicon interposer (LC-TSI). The performances of symmetrical spiral and 3D inductors are presented and analyzed in this paper. Realizing the integration of MIM capacitor with polymer-based RDL process, Ti/Ta/TaN resistors and high-Q inductors into LC-TSI platform fabrication together is discussed. The performance of these structures is given and the results show that the TSI platform is an attractive and promising method as a carrier to design IPDs.",
keywords = "3D symmetrical inductor, MIM capacitor, RLC integration, integrated passive device (IPD), low-cost through silicon interposer (LC-TSI)",
author = "Cheng Jin and Guruprasad Katti and Songbai Zhang",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 ; Conference date: 03-12-2014 Through 05-12-2014",
year = "2014",
month = jan,
day = "30",
doi = "10.1109/EPTC.2014.7028270",
language = "English",
series = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "265--268",
booktitle = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",
address = "United States",
}