Integrated passive devices on through silicon interposer with re-distribution layers

Cheng Jin; Guruprasad Katti; Songbai Zhang

doi:10.1109/EPTC.2014.7028270

Integrated passive devices on through silicon interposer with re-distribution layers

Cheng Jin, Guruprasad Katti, Songbai Zhang

School of Cyberspace Science and Technology

Agency for Science, Technology and Research, Singapore

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Citations (Scopus)

Abstract

This paper presents the design, integration and characterization of integrated passive devices (IPDs) on low cost through silicon interposer (LC-TSI). The performances of symmetrical spiral and 3D inductors are presented and analyzed in this paper. Realizing the integration of MIM capacitor with polymer-based RDL process, Ti/Ta/TaN resistors and high-Q inductors into LC-TSI platform fabrication together is discussed. The performance of these structures is given and the results show that the TSI platform is an attractive and promising method as a carrier to design IPDs.

Original language	English
Title of host publication	Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	265-268
Number of pages	4
ISBN (Electronic)	9781479969944
DOIs	https://doi.org/10.1109/EPTC.2014.7028270
Publication status	Published - 30 Jan 2014
Event	2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 - Singapore, Singapore Duration: 3 Dec 2014 → 5 Dec 2014

Publication series

Name	Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

Conference

Conference	2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014
Country/Territory	Singapore
City	Singapore
Period	3/12/14 → 5/12/14

Keywords

3D symmetrical inductor
MIM capacitor
RLC integration
integrated passive device (IPD)
low-cost through silicon interposer (LC-TSI)

Access to Document

10.1109/EPTC.2014.7028270

Cite this

Jin, C., Katti, G., & Zhang, S. (2014). Integrated passive devices on through silicon interposer with re-distribution layers. In Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014 (pp. 265-268). Article 7028270 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2014.7028270

Jin, Cheng ; Katti, Guruprasad ; Zhang, Songbai. / Integrated passive devices on through silicon interposer with re-distribution layers. Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 265-268 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

@inproceedings{5e548a063f8d40e5ba43501a65155070,

title = "Integrated passive devices on through silicon interposer with re-distribution layers",

abstract = "This paper presents the design, integration and characterization of integrated passive devices (IPDs) on low cost through silicon interposer (LC-TSI). The performances of symmetrical spiral and 3D inductors are presented and analyzed in this paper. Realizing the integration of MIM capacitor with polymer-based RDL process, Ti/Ta/TaN resistors and high-Q inductors into LC-TSI platform fabrication together is discussed. The performance of these structures is given and the results show that the TSI platform is an attractive and promising method as a carrier to design IPDs.",

keywords = "3D symmetrical inductor, MIM capacitor, RLC integration, integrated passive device (IPD), low-cost through silicon interposer (LC-TSI)",

author = "Cheng Jin and Guruprasad Katti and Songbai Zhang",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 ; Conference date: 03-12-2014 Through 05-12-2014",

year = "2014",

month = jan,

day = "30",

doi = "10.1109/EPTC.2014.7028270",

language = "English",

series = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "265--268",

booktitle = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",

address = "United States",

}

Jin, C, Katti, G & Zhang, S 2014, Integrated passive devices on through silicon interposer with re-distribution layers. in Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014., 7028270, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014, Institute of Electrical and Electronics Engineers Inc., pp. 265-268, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore, 3/12/14. https://doi.org/10.1109/EPTC.2014.7028270

Integrated passive devices on through silicon interposer with re-distribution layers. / Jin, Cheng; Katti, Guruprasad; Zhang, Songbai.
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 265-268 7028270 (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Integrated passive devices on through silicon interposer with re-distribution layers

AU - Jin, Cheng

AU - Katti, Guruprasad

AU - Zhang, Songbai

PY - 2014/1/30

Y1 - 2014/1/30

N2 - This paper presents the design, integration and characterization of integrated passive devices (IPDs) on low cost through silicon interposer (LC-TSI). The performances of symmetrical spiral and 3D inductors are presented and analyzed in this paper. Realizing the integration of MIM capacitor with polymer-based RDL process, Ti/Ta/TaN resistors and high-Q inductors into LC-TSI platform fabrication together is discussed. The performance of these structures is given and the results show that the TSI platform is an attractive and promising method as a carrier to design IPDs.

AB - This paper presents the design, integration and characterization of integrated passive devices (IPDs) on low cost through silicon interposer (LC-TSI). The performances of symmetrical spiral and 3D inductors are presented and analyzed in this paper. Realizing the integration of MIM capacitor with polymer-based RDL process, Ti/Ta/TaN resistors and high-Q inductors into LC-TSI platform fabrication together is discussed. The performance of these structures is given and the results show that the TSI platform is an attractive and promising method as a carrier to design IPDs.

KW - 3D symmetrical inductor

KW - MIM capacitor

KW - RLC integration

KW - integrated passive device (IPD)

KW - low-cost through silicon interposer (LC-TSI)

UR - http://www.scopus.com/inward/record.url?scp=84946690362&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2014.7028270

DO - 10.1109/EPTC.2014.7028270

M3 - Conference contribution

AN - SCOPUS:84946690362

T3 - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

SP - 265

EP - 268

BT - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014

Y2 - 3 December 2014 through 5 December 2014

ER -

Jin C, Katti G, Zhang S. Integrated passive devices on through silicon interposer with re-distribution layers. In Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 265-268. 7028270. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014). doi: 10.1109/EPTC.2014.7028270

Integrated passive devices on through silicon interposer with re-distribution layers

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