TY - JOUR
T1 - Influence of interphase type and thickness on the interface properties and tensile damage evolution of C/SiC composites
AU - Li, Longbiao
AU - Su, Kang
AU - Chen, Zhaoke
AU - Zhang, Zhongwei
AU - Xiong, Xiang
N1 - Publisher Copyright:
© IMechE 2024.
PY - 2024/9
Y1 - 2024/9
N2 - In this paper, the influence of interphase type (i.e. single-phase (PyC) and co-deposited (PyC+SiC)) and thickness (i.e. 300, 600, 1000, and 2000 nm) on the interface properties and damage evolution of mini-C/SiC composites under cyclic loading/unloading tension was investigated. The micromechanical constitutive model was adopted to derive the damage parameter of inverse tangent modulus (ITM) and perform the hysteresis analysis to estimate the interface properties of the mini-C/SiC composites with large debonding energy. Experimental damage evolution of the ITMs with unloading or reloading stress was analyzed for different interphase types and thickness. The interface properties (e.g. the interface debonding stress and interface debonding energy) were obtained through the hysteresis analysis. Relationships between the loading/unloading ITMs, interface properties, and interphase type and thickness were established.
AB - In this paper, the influence of interphase type (i.e. single-phase (PyC) and co-deposited (PyC+SiC)) and thickness (i.e. 300, 600, 1000, and 2000 nm) on the interface properties and damage evolution of mini-C/SiC composites under cyclic loading/unloading tension was investigated. The micromechanical constitutive model was adopted to derive the damage parameter of inverse tangent modulus (ITM) and perform the hysteresis analysis to estimate the interface properties of the mini-C/SiC composites with large debonding energy. Experimental damage evolution of the ITMs with unloading or reloading stress was analyzed for different interphase types and thickness. The interface properties (e.g. the interface debonding stress and interface debonding energy) were obtained through the hysteresis analysis. Relationships between the loading/unloading ITMs, interface properties, and interphase type and thickness were established.
KW - C/SiC
KW - hysteresis loops
KW - interface properties
KW - inverse tangent modulus
UR - http://www.scopus.com/inward/record.url?scp=85186602716&partnerID=8YFLogxK
U2 - 10.1177/14644207241234395
DO - 10.1177/14644207241234395
M3 - Article
AN - SCOPUS:85186602716
SN - 1464-4207
VL - 238
SP - 1805
EP - 1823
JO - Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications
JF - Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications
IS - 9
ER -