Influence of dislocation density & solute atoms concentration on the electroplastic effect OF Al-Cu alloy

Weichao Wu, Chaorun Si, Chun Xu, Tian Xue

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

The influences of dislocation magnification due to plastic deformation and solute atoms concentration on the electroplastic effect were investigated. It is found that the dislocation magnification due to plastic deformation will enhance the electroplastic effect. The electroplastic effect of Al- Cu alloy was enhanced with the increase of plastic deformation and current density. Moreover, the solute atoms concentration has a great effect on the electroplastic effect. The influence of electrical current pulse on Portevin-Le Chatelier (PLC) effect of Al-Cu alloy is also reported.

Original languageEnglish
Title of host publicationProcesses
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791850725
DOIs
Publication statusPublished - 2017
EventASME 2017 12th International Manufacturing Science and Engineering Conference, MSEC 2017 collocated with the JSME/ASME 2017 6th International Conference on Materials and Processing - Los Angeles, United States
Duration: 4 Jun 20178 Jun 2017

Publication series

NameASME 2017 12th International Manufacturing Science and Engineering Conference, MSEC 2017 collocated with the JSME/ASME 2017 6th International Conference on Materials and Processing
Volume1

Conference

ConferenceASME 2017 12th International Manufacturing Science and Engineering Conference, MSEC 2017 collocated with the JSME/ASME 2017 6th International Conference on Materials and Processing
Country/TerritoryUnited States
CityLos Angeles
Period4/06/178/06/17

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