TY - JOUR
T1 - Improved thermal conductivity of silicon carbide fibers-reinforced silicon carbide matrix composites by chemical vapor infiltration method
AU - Tao, Pengfei
AU - Wang, Yiguang
N1 - Publisher Copyright:
© 2018 Elsevier Ltd and Techna Group S.r.l.
PY - 2019/2/1
Y1 - 2019/2/1
N2 - A barrier for the application of silicon carbide fibers-reinforced silicon carbide matrix (SiCf/SiC) composites fabricated by chemical vapor infiltration (CVI) as nuclear cladding materials is its low thermal conductivity, which is caused by high porosity. In this study, we reported new processing approach to fabricate SiCf/SiC composites by introducing about 4 vol% SiC nanowires (NWs) in SiCf preform, followed by CVI process. Microstructure, distribution of pore size, thermal conductivity, and bending strength of obtained SiCf/SiC composites with and without NWs were studied. Results showed that densification of both intra-bundles and inter-bundles of SiCf/SiC-NW composite was improved by introducing SiC NWs into the preform. With the decrease in the porosity, SiCf/SiC-NW exhibited thermal conductivity of 26.7 W m−1 K−1 at room temperature. Moreover, bending strength of SiCf/SiC-NW composite was up to 482 ± 36 MPa, which had an improvement of 19% compared to that of traditional SiCf/SiC composite.
AB - A barrier for the application of silicon carbide fibers-reinforced silicon carbide matrix (SiCf/SiC) composites fabricated by chemical vapor infiltration (CVI) as nuclear cladding materials is its low thermal conductivity, which is caused by high porosity. In this study, we reported new processing approach to fabricate SiCf/SiC composites by introducing about 4 vol% SiC nanowires (NWs) in SiCf preform, followed by CVI process. Microstructure, distribution of pore size, thermal conductivity, and bending strength of obtained SiCf/SiC composites with and without NWs were studied. Results showed that densification of both intra-bundles and inter-bundles of SiCf/SiC-NW composite was improved by introducing SiC NWs into the preform. With the decrease in the porosity, SiCf/SiC-NW exhibited thermal conductivity of 26.7 W m−1 K−1 at room temperature. Moreover, bending strength of SiCf/SiC-NW composite was up to 482 ± 36 MPa, which had an improvement of 19% compared to that of traditional SiCf/SiC composite.
KW - Preform structure
KW - SiC nanowires
KW - SiC/SiC composites
KW - Thermal conductivity
UR - http://www.scopus.com/inward/record.url?scp=85055108603&partnerID=8YFLogxK
U2 - 10.1016/j.ceramint.2018.10.132
DO - 10.1016/j.ceramint.2018.10.132
M3 - Article
AN - SCOPUS:85055108603
SN - 0272-8842
VL - 45
SP - 2207
EP - 2212
JO - Ceramics International
JF - Ceramics International
IS - 2
ER -