High impact dynamic simulation of planar S-form micro-spring

Ying Wang, Wenzhong Lou, Yue Fu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Citations (Scopus)

Abstract

This paper describes the research status of MEMS spring used in fuze. For the Nickel planar S-form micro-spring, according to its application environment and design requirements, the length of the straight beam was taken as the only variable to study the variation of the micro-spring dynamic stiffness under high impact load. These researches can provide some reference views to design applications and reliability analysis of micro-spring used in the munitions, and also can lay the foundation for the response characteristics of the micro-scale elastic components under impact load.

Original languageEnglish
Title of host publicationMicro-Nano Technology XIV
PublisherTrans Tech Publications Ltd.
Pages1107-1110
Number of pages4
ISBN (Print)9783037857397
DOIs
Publication statusPublished - 2013
Event14th Annual Conference and the 3rd International Conference of the Chinese Society of Micro-Nano Technology, CSMNT 2012 - Hangzhou, China
Duration: 4 Nov 20127 Nov 2012

Publication series

NameKey Engineering Materials
Volume562-565
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Conference

Conference14th Annual Conference and the 3rd International Conference of the Chinese Society of Micro-Nano Technology, CSMNT 2012
Country/TerritoryChina
CityHangzhou
Period4/11/127/11/12

Keywords

  • Dynamic stiffness
  • High impact
  • S-form micro-spring
  • Simulation analysis

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