Growth of silicon oxynitride films by atmospheric pressure plasma jet

Xueqiang Zhang, Sylwia Ptasinska

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18 Citations (Scopus)

Abstract

Ultra-thin silicon oxynitride (SiOxNy) layers were deposited by direct interaction of plasma species formed in an atmospheric pressure plasma jet (APPJ) with a silicon wafer. APPJs have been ignited in mixtures of helium (He) together with several nitrogen-based compounds. The chemical composition of the APPJ treated silicon surfaces was analysed by ultra-high vacuum x-ray photoelectron spectroscopy (XPS). The obtained N 1s XPS spectra showed that even 5 min of APPJ treatment is sufficient to fabricate SiOxNy films with a few nanometre thickness. A Si substrate exposed to an APPJ generated in a mixture of He/NH3 resulted in the most efficient growth of SiOxNy films, indicated by the strongest N 1s XPS signal among all studied gas mixtures. Moreover, the N 1s spectra exhibited two major characteristics of chemical bonding structures attributed to nitrogen bonded to three silicon surface atoms, N-(S)3, and nitrogen bonded to two silicon surface atoms and one oxygen atom, (Si)2-N-O.

Original languageEnglish
Article number145202
JournalJournal Physics D: Applied Physics
Volume47
Issue number14
DOIs
Publication statusPublished - 9 Apr 2014
Externally publishedYes

Keywords

  • XPS
  • atmospheric pressure plasma
  • chemical reactivity
  • silicon oxynitride

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Zhang, X., & Ptasinska, S. (2014). Growth of silicon oxynitride films by atmospheric pressure plasma jet. Journal Physics D: Applied Physics, 47(14), Article 145202. https://doi.org/10.1088/0022-3727/47/14/145202