Graphene foam-embedded epoxy composites with significant thermal conductivity enhancement

Zhiduo Liu; Yapeng Chen; Yifan Li; Wen Dai; Qingwei Yan; Fakhr E. Alam; Shiyu Du; Zhongwei Wang; Kazuhito Nishimura; Nan Jiang; Cheng Te Lin; Jinhong Yu

doi:10.1039/c9nr03968f

Graphene foam-embedded epoxy composites with significant thermal conductivity enhancement

Zhiduo Liu, Yapeng Chen, Yifan Li, Wen Dai, Qingwei Yan, Fakhr E. Alam, Shiyu Du, Zhongwei Wang, Kazuhito Nishimura, Nan Jiang, Cheng Te Lin, Jinhong Yu^*

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

125 Citations (Scopus)

Abstract

High thermal conductivity polymer composites at low filler loading are of considerable interest because of their wide range of applications. The construction of three-dimensional (3D) interconnected networks can offer a high-efficiency increase for the thermal conductivity of polymer composites. In this work, a facile and scalable method to prepare graphene foam (GF) via sacrificial commercial polyurethane (PU) sponge templates was developed. Highly thermally conductive composites were then prepared by impregnating epoxy resin into the GF structure. An ultrahigh thermal conductivity of 8.04 W m^-1 K^-1 was obtained at a low graphene loading of 6.8 wt%, which corresponds to a thermal conductivity enhancement of about 4473% compared to neat epoxy. This strategy provides a facile, low-cost and scalable method to construct a 3D filler network for high-performance composites with potential to be used in advanced electronic packaging.

Original language	English
Pages (from-to)	17600-17606
Number of pages	7
Journal	Nanoscale
Volume	11
Issue number	38
DOIs	https://doi.org/10.1039/c9nr03968f
Publication status	Published - 14 Oct 2019
Externally published	Yes

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title = "Graphene foam-embedded epoxy composites with significant thermal conductivity enhancement",

abstract = "High thermal conductivity polymer composites at low filler loading are of considerable interest because of their wide range of applications. The construction of three-dimensional (3D) interconnected networks can offer a high-efficiency increase for the thermal conductivity of polymer composites. In this work, a facile and scalable method to prepare graphene foam (GF) via sacrificial commercial polyurethane (PU) sponge templates was developed. Highly thermally conductive composites were then prepared by impregnating epoxy resin into the GF structure. An ultrahigh thermal conductivity of 8.04 W m-1 K-1 was obtained at a low graphene loading of 6.8 wt%, which corresponds to a thermal conductivity enhancement of about 4473% compared to neat epoxy. This strategy provides a facile, low-cost and scalable method to construct a 3D filler network for high-performance composites with potential to be used in advanced electronic packaging.",

author = "Zhiduo Liu and Yapeng Chen and Yifan Li and Wen Dai and Qingwei Yan and Alam, {Fakhr E.} and Shiyu Du and Zhongwei Wang and Kazuhito Nishimura and Nan Jiang and Lin, {Cheng Te} and Jinhong Yu",

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doi = "10.1039/c9nr03968f",

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TY - JOUR

T1 - Graphene foam-embedded epoxy composites with significant thermal conductivity enhancement

AU - Liu, Zhiduo

AU - Chen, Yapeng

AU - Li, Yifan

AU - Dai, Wen

AU - Yan, Qingwei

AU - Alam, Fakhr E.

AU - Du, Shiyu

AU - Wang, Zhongwei

AU - Nishimura, Kazuhito

AU - Jiang, Nan

AU - Lin, Cheng Te

AU - Yu, Jinhong

PY - 2019/10/14

Y1 - 2019/10/14

N2 - High thermal conductivity polymer composites at low filler loading are of considerable interest because of their wide range of applications. The construction of three-dimensional (3D) interconnected networks can offer a high-efficiency increase for the thermal conductivity of polymer composites. In this work, a facile and scalable method to prepare graphene foam (GF) via sacrificial commercial polyurethane (PU) sponge templates was developed. Highly thermally conductive composites were then prepared by impregnating epoxy resin into the GF structure. An ultrahigh thermal conductivity of 8.04 W m-1 K-1 was obtained at a low graphene loading of 6.8 wt%, which corresponds to a thermal conductivity enhancement of about 4473% compared to neat epoxy. This strategy provides a facile, low-cost and scalable method to construct a 3D filler network for high-performance composites with potential to be used in advanced electronic packaging.

AB - High thermal conductivity polymer composites at low filler loading are of considerable interest because of their wide range of applications. The construction of three-dimensional (3D) interconnected networks can offer a high-efficiency increase for the thermal conductivity of polymer composites. In this work, a facile and scalable method to prepare graphene foam (GF) via sacrificial commercial polyurethane (PU) sponge templates was developed. Highly thermally conductive composites were then prepared by impregnating epoxy resin into the GF structure. An ultrahigh thermal conductivity of 8.04 W m-1 K-1 was obtained at a low graphene loading of 6.8 wt%, which corresponds to a thermal conductivity enhancement of about 4473% compared to neat epoxy. This strategy provides a facile, low-cost and scalable method to construct a 3D filler network for high-performance composites with potential to be used in advanced electronic packaging.

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U2 - 10.1039/c9nr03968f

DO - 10.1039/c9nr03968f

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SN - 2040-3364

VL - 11

SP - 17600

EP - 17606

JO - Nanoscale

JF - Nanoscale

IS - 38

ER -

Graphene foam-embedded epoxy composites with significant thermal conductivity enhancement

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