Abstract
In this paper, we propose a mixed reality system consisting of a binocular optical see-Through head-mounted display(OST-HMD) and a depth sensor. Based on the proposed system, participants perform manipulation tasks to experience the direct physics-inspired interaction mode. Moreover, we design an active selection rule for accurate detailed manipulation. The result indicates that although direct physics-inspired interaction mode is not sufficiently efficient, it shows an advantage regarding the humanization and attraction.
Original language | English |
---|---|
Title of host publication | Proceedings - 2017 International Conference on Virtual Reality and Visualization, ICVRV 2017 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 404-405 |
Number of pages | 2 |
ISBN (Electronic) | 9781538626368 |
DOIs | |
Publication status | Published - 2 Jul 2017 |
Event | 7th International Conference on Virtual Reality and Visualization, ICVRV 2017 - Zhengzhou, China Duration: 21 Oct 2017 → 22 Oct 2017 |
Publication series
Name | Proceedings - 2017 International Conference on Virtual Reality and Visualization, ICVRV 2017 |
---|
Conference
Conference | 7th International Conference on Virtual Reality and Visualization, ICVRV 2017 |
---|---|
Country/Territory | China |
City | Zhengzhou |
Period | 21/10/17 → 22/10/17 |
Keywords
- Active selection
- Mixed reality
- OST-HMD
- Physics-inspired interaction
Fingerprint
Dive into the research topics of 'Evaluation of direct physics-inspired interaction for mixed reality based on optical see-Through head-mounted displays'. Together they form a unique fingerprint.Cite this
Cao, B., Zhang, Z., & Weng, D. (2017). Evaluation of direct physics-inspired interaction for mixed reality based on optical see-Through head-mounted displays. In Proceedings - 2017 International Conference on Virtual Reality and Visualization, ICVRV 2017 (pp. 404-405). Article 8719116 (Proceedings - 2017 International Conference on Virtual Reality and Visualization, ICVRV 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICVRV.2017.00097