Enhanced thermal transport performance for poly(vinylidene fluoride) composites with superfullerene

Yuming Wu, Yong Cao, Xueshan Xiao*, Zhiduo Liu, Mengjie Wang, Nan Jiang, Xinfeng Wu, Cheng Te Lin, Jinhong Yu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

High thermal conductive polymer composites have recently attracted much attention, along with the quick development to the electronic devices toward higher speed. The addition of high thermal conductive fillers is an efficient method to solve this problem. Here, we introduced superfullerene (SF), a novel zero-dimensional carbon-based filler, and incorporated into PVDF by a solution method. The effects of SF filler on the thermal conductivity of PVDF composites were systematically investigated. It was found that PVDF composites exhibited an improvement in thermal conductivity at a low SF loading. PVDF composites with only 5 wt% SF filler present the thermal conductivity value of 0.365 Wm-1K-1, which is as much as 121 % enhancement in comparison with that of neat PVDF. In view of the excellent thermal transport performance, the composites may enable some applications in thermal management in the future.

Original languageEnglish
Pages (from-to)1180-1186
Number of pages7
JournalFibers and Polymers
Volume18
Issue number6
DOIs
Publication statusPublished - 1 Jun 2017
Externally publishedYes

Keywords

  • Poly(vinylidene fluoride)
  • Superfullerene
  • Thermal conductivity

Fingerprint

Dive into the research topics of 'Enhanced thermal transport performance for poly(vinylidene fluoride) composites with superfullerene'. Together they form a unique fingerprint.

Cite this