Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO2 nanowires

Dianyu Shen; Mengjie Wang; Yuming Wu; Zhiduo Liu; Yong Cao; Ting Wang; Xinfeng Wu; Qingtang Shi; Kuan W.A. Chee; Wen Dai; Hua Bai; Dan Dai; Jilei Lyu; Nan Jiang; Cheng Te Lin; Jinhong Yu

doi:10.1049/hve.2017.0041

Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO₂ nanowires

Dianyu Shen, Mengjie Wang, Yuming Wu, Zhiduo Liu, Yong Cao, Ting Wang, Xinfeng Wu, Qingtang Shi, Kuan W.A. Chee, Wen Dai, Hua Bai, Dan Dai, Jilei Lyu, Nan Jiang^*, Cheng Te Lin, Jinhong Yu

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

30 Citations (Scopus)

Abstract

Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO₂ nanowires (SiC@SiO₂ NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO₂ NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO₂ NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m^-1 K^-1, increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO₂ NWs composites could be the ideal candidate for TIM.

Original language	English
Pages (from-to)	154-160
Number of pages	7
Journal	High Voltage
Volume	2
Issue number	3
DOIs	https://doi.org/10.1049/hve.2017.0041
Publication status	Published - Sept 2017
Externally published	Yes

Access to Document

10.1049/hve.2017.0041

Cite this

@article{db0b5f7b3f19411bae8aa37d3e929cd7,

title = "Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO2 nanowires",

abstract = "Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO2 nanowires (SiC@SiO2 NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO2 NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO2 NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m-1 K-1, increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO2 NWs composites could be the ideal candidate for TIM.",

author = "Dianyu Shen and Mengjie Wang and Yuming Wu and Zhiduo Liu and Yong Cao and Ting Wang and Xinfeng Wu and Qingtang Shi and Chee, {Kuan W.A.} and Wen Dai and Hua Bai and Dan Dai and Jilei Lyu and Nan Jiang and Lin, {Cheng Te} and Jinhong Yu",

year = "2017",

month = sep,

doi = "10.1049/hve.2017.0041",

language = "English",

volume = "2",

pages = "154--160",

journal = "High Voltage",

issn = "2397-7264",

publisher = "John Wiley & Sons Inc.",

number = "3",

}

TY - JOUR

T1 - Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO2 nanowires

AU - Shen, Dianyu

AU - Wang, Mengjie

AU - Wu, Yuming

AU - Liu, Zhiduo

AU - Cao, Yong

AU - Wang, Ting

AU - Wu, Xinfeng

AU - Shi, Qingtang

AU - Chee, Kuan W.A.

AU - Dai, Wen

AU - Bai, Hua

AU - Dai, Dan

AU - Lyu, Jilei

AU - Jiang, Nan

AU - Lin, Cheng Te

AU - Yu, Jinhong

PY - 2017/9

Y1 - 2017/9

N2 - Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO2 nanowires (SiC@SiO2 NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO2 NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO2 NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m-1 K-1, increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO2 NWs composites could be the ideal candidate for TIM.

AB - Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO2 nanowires (SiC@SiO2 NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO2 NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO2 NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m-1 K-1, increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO2 NWs composites could be the ideal candidate for TIM.

UR - http://www.scopus.com/inward/record.url?scp=85071905818&partnerID=8YFLogxK

U2 - 10.1049/hve.2017.0041

DO - 10.1049/hve.2017.0041

M3 - Article

AN - SCOPUS:85071905818

SN - 2397-7264

VL - 2

SP - 154

EP - 160

JO - High Voltage

JF - High Voltage

IS - 3

ER -

Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO₂ nanowires

Abstract

Access to Document

Other files and links

Fingerprint

Cite this