Shen, D., Wang, M., Wu, Y., Liu, Z., Cao, Y., Wang, T., Wu, X., Shi, Q., Chee, K. W. A., Dai, W., Bai, H., Dai, D., Lyu, J., Jiang, N., Lin, C. T., & Yu, J. (2017). Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO2 nanowires. High Voltage, 2(3), 154-160. https://doi.org/10.1049/hve.2017.0041
Shen, Dianyu ; Wang, Mengjie ; Wu, Yuming et al. / Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO2 nanowires. In: High Voltage. 2017 ; Vol. 2, No. 3. pp. 154-160.
@article{db0b5f7b3f19411bae8aa37d3e929cd7,
title = "Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO2 nanowires",
abstract = "Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO2 nanowires (SiC@SiO2 NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO2 NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO2 NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m-1 K-1, increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO2 NWs composites could be the ideal candidate for TIM.",
author = "Dianyu Shen and Mengjie Wang and Yuming Wu and Zhiduo Liu and Yong Cao and Ting Wang and Xinfeng Wu and Qingtang Shi and Chee, {Kuan W.A.} and Wen Dai and Hua Bai and Dan Dai and Jilei Lyu and Nan Jiang and Lin, {Cheng Te} and Jinhong Yu",
note = "Publisher Copyright: {\textcopyright} 2017 The Institution of Enginering and Technology. All rights reserved.",
year = "2017",
month = sep,
doi = "10.1049/hve.2017.0041",
language = "English",
volume = "2",
pages = "154--160",
journal = "High Voltage",
issn = "2397-7264",
publisher = "John Wiley & Sons Inc.",
number = "3",
}
Shen, D, Wang, M, Wu, Y, Liu, Z, Cao, Y, Wang, T, Wu, X, Shi, Q, Chee, KWA, Dai, W, Bai, H, Dai, D, Lyu, J, Jiang, N, Lin, CT & Yu, J 2017, 'Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO2 nanowires', High Voltage, vol. 2, no. 3, pp. 154-160. https://doi.org/10.1049/hve.2017.0041
Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO2 nanowires. / Shen, Dianyu; Wang, Mengjie; Wu, Yuming et al.
In:
High Voltage, Vol. 2, No. 3, 09.2017, p. 154-160.
Research output: Contribution to journal › Article › peer-review
TY - JOUR
T1 - Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO2 nanowires
AU - Shen, Dianyu
AU - Wang, Mengjie
AU - Wu, Yuming
AU - Liu, Zhiduo
AU - Cao, Yong
AU - Wang, Ting
AU - Wu, Xinfeng
AU - Shi, Qingtang
AU - Chee, Kuan W.A.
AU - Dai, Wen
AU - Bai, Hua
AU - Dai, Dan
AU - Lyu, Jilei
AU - Jiang, Nan
AU - Lin, Cheng Te
AU - Yu, Jinhong
N1 - Publisher Copyright:
© 2017 The Institution of Enginering and Technology. All rights reserved.
PY - 2017/9
Y1 - 2017/9
N2 - Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO2 nanowires (SiC@SiO2 NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO2 NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO2 NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m-1 K-1, increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO2 NWs composites could be the ideal candidate for TIM.
AB - Electronic packaging materials and thermal interface materials (TIMs) are widely used in thermal management. In this study, the epoxy composites with core-shell structure SiC@SiO2 nanowires (SiC@SiO2 NWs) as fillers could effectively enhance the thermal conductivity of epoxy composites. The unique structure of fillers results in a high thermal conductivity of epoxy composites, which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO2 NWs. From neat epoxy to 2.5 wt% loading of SiC@SiO2 NWs, the thermal conductivity is significantly increased from 0.218 to 0.391 W m-1 K-1, increased by 79.4%. In addition, the composite with 2.5 wt% filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy. All these outstanding properties imply that epoxy/SiC@SiO2 NWs composites could be the ideal candidate for TIM.
UR - http://www.scopus.com/inward/record.url?scp=85071905818&partnerID=8YFLogxK
U2 - 10.1049/hve.2017.0041
DO - 10.1049/hve.2017.0041
M3 - Article
AN - SCOPUS:85071905818
SN - 2397-7264
VL - 2
SP - 154
EP - 160
JO - High Voltage
JF - High Voltage
IS - 3
ER -
Shen D, Wang M, Wu Y, Liu Z, Cao Y, Wang T et al. Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO2 nanowires. High Voltage. 2017 Sept;2(3):154-160. doi: 10.1049/hve.2017.0041
