Shen, D., Zhan, Z., Liu, Z., Cao, Y., Zhou, L., Liu, Y., Dai, W., Nishimura, K., Li, C., Lin, C. T., Jiang, N., & Yu, J. (2017). Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires. Scientific Reports, 7(1), Article 2606. https://doi.org/10.1038/s41598-017-02929-0
Shen, Dianyu ; Zhan, Zhaolin ; Liu, Zhiduo et al. / Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires. In: Scientific Reports. 2017 ; Vol. 7, No. 1.
@article{9a7531a8b2634085975bc63c4028827b,
title = "Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires",
abstract = "In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm-1 K-1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.",
author = "Dianyu Shen and Zhaolin Zhan and Zhiduo Liu and Yong Cao and Li Zhou and Yuanli Liu and Wen Dai and Kazuhito Nishimura and Chaoyang Li and Lin, {Cheng Te} and Nan Jiang and Jinhong Yu",
note = "Publisher Copyright: {\textcopyright} 2017 The Author(s).",
year = "2017",
month = dec,
day = "1",
doi = "10.1038/s41598-017-02929-0",
language = "English",
volume = "7",
journal = "Scientific Reports",
issn = "2045-2322",
publisher = "Nature Publishing Group",
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}
Shen, D, Zhan, Z, Liu, Z, Cao, Y, Zhou, L, Liu, Y, Dai, W, Nishimura, K, Li, C, Lin, CT, Jiang, N & Yu, J 2017, 'Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires', Scientific Reports, vol. 7, no. 1, 2606. https://doi.org/10.1038/s41598-017-02929-0
Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires. / Shen, Dianyu; Zhan, Zhaolin
; Liu, Zhiduo et al.
In:
Scientific Reports, Vol. 7, No. 1, 2606, 01.12.2017.
Research output: Contribution to journal › Article › peer-review
TY - JOUR
T1 - Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires
AU - Shen, Dianyu
AU - Zhan, Zhaolin
AU - Liu, Zhiduo
AU - Cao, Yong
AU - Zhou, Li
AU - Liu, Yuanli
AU - Dai, Wen
AU - Nishimura, Kazuhito
AU - Li, Chaoyang
AU - Lin, Cheng Te
AU - Jiang, Nan
AU - Yu, Jinhong
N1 - Publisher Copyright:
© 2017 The Author(s).
PY - 2017/12/1
Y1 - 2017/12/1
N2 - In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm-1 K-1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.
AB - In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm-1 K-1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.
UR - http://www.scopus.com/inward/record.url?scp=85020172498&partnerID=8YFLogxK
U2 - 10.1038/s41598-017-02929-0
DO - 10.1038/s41598-017-02929-0
M3 - Article
C2 - 28572604
AN - SCOPUS:85020172498
SN - 2045-2322
VL - 7
JO - Scientific Reports
JF - Scientific Reports
IS - 1
M1 - 2606
ER -
Shen D, Zhan Z, Liu Z, Cao Y, Zhou L, Liu Y et al. Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires. Scientific Reports. 2017 Dec 1;7(1):2606. doi: 10.1038/s41598-017-02929-0
