Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

Dianyu Shen; Zhaolin Zhan; Zhiduo Liu; Yong Cao; Li Zhou; Yuanli Liu; Wen Dai; Kazuhito Nishimura; Chaoyang Li; Cheng Te Lin; Nan Jiang; Jinhong Yu

doi:10.1038/s41598-017-02929-0

Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

Dianyu Shen, Zhaolin Zhan^*, Zhiduo Liu, Yong Cao, Li Zhou, Yuanli Liu, Wen Dai, Kazuhito Nishimura, Chaoyang Li, Cheng Te Lin, Nan Jiang, Jinhong Yu

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

124 Citations (Scopus)

Abstract

In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm^-1 K^-1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.

Original language	English
Article number	2606
Journal	Scientific Reports
Volume	7
Issue number	1
DOIs	https://doi.org/10.1038/s41598-017-02929-0
Publication status	Published - 1 Dec 2017
Externally published	Yes

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title = "Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires",

abstract = "In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm-1 K-1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.",

author = "Dianyu Shen and Zhaolin Zhan and Zhiduo Liu and Yong Cao and Li Zhou and Yuanli Liu and Wen Dai and Kazuhito Nishimura and Chaoyang Li and Lin, {Cheng Te} and Nan Jiang and Jinhong Yu",

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year = "2017",

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doi = "10.1038/s41598-017-02929-0",

language = "English",

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T1 - Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

AU - Shen, Dianyu

AU - Zhan, Zhaolin

AU - Liu, Zhiduo

AU - Cao, Yong

AU - Zhou, Li

AU - Liu, Yuanli

AU - Dai, Wen

AU - Nishimura, Kazuhito

AU - Li, Chaoyang

AU - Lin, Cheng Te

AU - Jiang, Nan

AU - Yu, Jinhong

PY - 2017/12/1

Y1 - 2017/12/1

N2 - In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm-1 K-1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.

AB - In this study, we report a facile approach to fabricate epoxy composite incorporated with silicon carbide nanowires (SiC NWs). The thermal conductivity of epoxy/SiC NWs composites was thoroughly investigated. The thermal conductivity of epoxy/SiC NWs composites with 3.0 wt% filler reached 0.449 Wm-1 K-1, approximately a 106% enhancement as compared to neat epoxy. In contrast, the same mass fraction of silicon carbide micron particles (SiC MPs) incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is attributed to the formation of effective heat conduction pathways among SiC NWs as well as a strong interaction between the nanowires and epoxy matrix. In addition, the thermal properties of epoxy/SiC NWs composites were also improved. These results demonstrate that we developed a novel approach to enhance the thermal conductivity of the polymer composites which meet the requirement for the rapid development of the electronic devices.

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U2 - 10.1038/s41598-017-02929-0

DO - 10.1038/s41598-017-02929-0

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SN - 2045-2322

VL - 7

JO - Scientific Reports

JF - Scientific Reports

IS - 1

M1 - 2606

ER -

Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

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