Enhanced performance of 17.7 GHz SAW devices based on AlN/diamond/Si layered structure with embedded nanotransducer

Lei Wang; Shuming Chen; Jinying Zhang; Dingbang Xiao; Kaifeng Han; Xi Ning; Jingtian Liu; Zhe Chen; Jian Zhou

doi:10.1063/1.5006884

Enhanced performance of 17.7 GHz SAW devices based on AlN/diamond/Si layered structure with embedded nanotransducer

Lei Wang, Shuming Chen, Jinying Zhang, Dingbang Xiao, Kaifeng Han, Xi Ning, Jingtian Liu, Zhe Chen, Jian Zhou

Research output: Contribution to journal › Article › peer-review

30 Citations (Scopus)

Abstract

Surface acoustic wave (SAW) devices using embedded interdigital transducers (IDTs) on an AlN/diamond/Si layered substrate are fabricated, and their performances are investigated. The Sezawa mode is the dominant resonance with the highest resonant frequency up to 17.7 GHz, a signal amplitude of 20 dB, and an electromechanical coupling coefficient of 0.92%. Comparing these SAW devices with those having the conventional IDTs on the same layered structure, the output SAW power and resonant frequency of devices are improved by 10.7% and 1.1%, respectively, for the embedded IDT devices. This is because the different field distribution leads to the different Bragg reflection and phase velocity for the two types of IDTs. The radiation frequency characteristics indicate that the advantages of the embedded IDTs would be useful for high frequency, high power applications such as monolithic integrated millimeter-wave integrated circuit and high speed communications.

Original language	English
Article number	253502
Journal	Applied Physics Letters
Volume	111
Issue number	25
DOIs	https://doi.org/10.1063/1.5006884
Publication status	Published - 18 Dec 2017
Externally published	Yes

Access to Document

10.1063/1.5006884

Cite this

@article{7fe7266b78314b619e291bc7fcfaa815,

title = "Enhanced performance of 17.7 GHz SAW devices based on AlN/diamond/Si layered structure with embedded nanotransducer",

abstract = "Surface acoustic wave (SAW) devices using embedded interdigital transducers (IDTs) on an AlN/diamond/Si layered substrate are fabricated, and their performances are investigated. The Sezawa mode is the dominant resonance with the highest resonant frequency up to 17.7 GHz, a signal amplitude of 20 dB, and an electromechanical coupling coefficient of 0.92%. Comparing these SAW devices with those having the conventional IDTs on the same layered structure, the output SAW power and resonant frequency of devices are improved by 10.7% and 1.1%, respectively, for the embedded IDT devices. This is because the different field distribution leads to the different Bragg reflection and phase velocity for the two types of IDTs. The radiation frequency characteristics indicate that the advantages of the embedded IDTs would be useful for high frequency, high power applications such as monolithic integrated millimeter-wave integrated circuit and high speed communications.",

author = "Lei Wang and Shuming Chen and Jinying Zhang and Dingbang Xiao and Kaifeng Han and Xi Ning and Jingtian Liu and Zhe Chen and Jian Zhou",

note = "Publisher Copyright: {\textcopyright} 2017 Author(s).",

year = "2017",

month = dec,

day = "18",

doi = "10.1063/1.5006884",

language = "English",

volume = "111",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "American Institute of Physics",

number = "25",

}

TY - JOUR

T1 - Enhanced performance of 17.7 GHz SAW devices based on AlN/diamond/Si layered structure with embedded nanotransducer

AU - Wang, Lei

AU - Chen, Shuming

AU - Zhang, Jinying

AU - Xiao, Dingbang

AU - Han, Kaifeng

AU - Ning, Xi

AU - Liu, Jingtian

AU - Chen, Zhe

AU - Zhou, Jian

PY - 2017/12/18

Y1 - 2017/12/18

N2 - Surface acoustic wave (SAW) devices using embedded interdigital transducers (IDTs) on an AlN/diamond/Si layered substrate are fabricated, and their performances are investigated. The Sezawa mode is the dominant resonance with the highest resonant frequency up to 17.7 GHz, a signal amplitude of 20 dB, and an electromechanical coupling coefficient of 0.92%. Comparing these SAW devices with those having the conventional IDTs on the same layered structure, the output SAW power and resonant frequency of devices are improved by 10.7% and 1.1%, respectively, for the embedded IDT devices. This is because the different field distribution leads to the different Bragg reflection and phase velocity for the two types of IDTs. The radiation frequency characteristics indicate that the advantages of the embedded IDTs would be useful for high frequency, high power applications such as monolithic integrated millimeter-wave integrated circuit and high speed communications.

AB - Surface acoustic wave (SAW) devices using embedded interdigital transducers (IDTs) on an AlN/diamond/Si layered substrate are fabricated, and their performances are investigated. The Sezawa mode is the dominant resonance with the highest resonant frequency up to 17.7 GHz, a signal amplitude of 20 dB, and an electromechanical coupling coefficient of 0.92%. Comparing these SAW devices with those having the conventional IDTs on the same layered structure, the output SAW power and resonant frequency of devices are improved by 10.7% and 1.1%, respectively, for the embedded IDT devices. This is because the different field distribution leads to the different Bragg reflection and phase velocity for the two types of IDTs. The radiation frequency characteristics indicate that the advantages of the embedded IDTs would be useful for high frequency, high power applications such as monolithic integrated millimeter-wave integrated circuit and high speed communications.

UR - http://www.scopus.com/inward/record.url?scp=85040028894&partnerID=8YFLogxK

U2 - 10.1063/1.5006884

DO - 10.1063/1.5006884

M3 - Article

AN - SCOPUS:85040028894

SN - 0003-6951

VL - 111

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 25

M1 - 253502

ER -

Enhanced performance of 17.7 GHz SAW devices based on AlN/diamond/Si layered structure with embedded nanotransducer

Abstract

Access to Document

Other files and links

Fingerprint

Cite this