Dynamic Adaptive Variable-Fidelity Modeling Method for BGA Solder Joint Design

Guannan Li, Jingdan Yu, Ru Wang*, Yan Yan

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Currently, building variable-fidelity surrogate models and using dynamic adaptive sampling is becoming a hot research topic in the field of surrogate-based design (SBD). However, due to its unique sample composition, the variable-fidelity model not only needs to consider the acquisition method of sampling points but also the number of samples with different fidelity levels. This poses higher requirements for dynamic adaptive sampling strategies. In this paper, we propose a co-kriging sequential modeling method based on SOM and LHD, which uses the space volume determined by SOM to obtain the sampling number of different fidelity samples. The feasibility of the proposed method was verified using the reliability problem of BGA soldering. Comparing the results obtained by the one-time modeling method for this problem, we discussed the advantages and disadvantages of this approach.

Original languageEnglish
Title of host publicationAdvances in Mechanical Design - The Proceedings of the 2023 International Conference on Mechanical Design, ICMD 2023
EditorsJianrong Tan, Yu Liu, Hong-Zhong Huang, Jingjun Yu, Zequn Wang
PublisherSpringer Science and Business Media B.V.
Pages723-733
Number of pages11
ISBN (Print)9789819709212
DOIs
Publication statusPublished - 2024
EventInternational Conference on Mechanical Design, ICMD 2023 - Chengdu, China
Duration: 20 Oct 202322 Oct 2023

Publication series

NameMechanisms and Machine Science
Volume155 MMS
ISSN (Print)2211-0984
ISSN (Electronic)2211-0992

Conference

ConferenceInternational Conference on Mechanical Design, ICMD 2023
Country/TerritoryChina
CityChengdu
Period20/10/2322/10/23

Keywords

  • Co-kriging
  • Dynamic modeling
  • SOM

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Li, G., Yu, J., Wang, R., & Yan, Y. (2024). Dynamic Adaptive Variable-Fidelity Modeling Method for BGA Solder Joint Design. In J. Tan, Y. Liu, H.-Z. Huang, J. Yu, & Z. Wang (Eds.), Advances in Mechanical Design - The Proceedings of the 2023 International Conference on Mechanical Design, ICMD 2023 (pp. 723-733). (Mechanisms and Machine Science; Vol. 155 MMS). Springer Science and Business Media B.V.. https://doi.org/10.1007/978-981-97-0922-9_47