Design of multilayer substrates microstrip patch antenna for fuze application

Wang Ting*, Lixin Xu, Zhanzhong Cui

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

A broadband microstrip patch antenna with multi-layer substrate for fuze application is designed. The multi-layer substrate is composed of the bottom layer of Si with low electric conductivity, the middle and the top layers of Si with high electric conductivity. An air cavity is fabricated by inductively coupled plasma (ICP) etching in the middle layer of Si to reduce the effective dielectric constant of the multi-layer substrate. The multi-layer substrate microstrip patch antenna is simulated and optimized by finite element method. The simulation results show that operating at 10GHz, the bandwidth and the gain of the multi-layer substrate microstrip patch antenna are 15.5% and 6.1dB respectively, which meet the needs of the application in fuze well.

Original languageEnglish
Title of host publicationAdvanced Research on Mechanical Engineering, Industry and Manufacturing Engineering
Pages51-54
Number of pages4
DOIs
Publication statusPublished - 2011
Event2011 International Conference on Mechanical Engineering, Industry and Manufacturing Engineering, MEIME2011 - Beijing, China
Duration: 23 Jul 201124 Jul 2011

Publication series

NameApplied Mechanics and Materials
Volume63-64
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Conference

Conference2011 International Conference on Mechanical Engineering, Industry and Manufacturing Engineering, MEIME2011
Country/TerritoryChina
CityBeijing
Period23/07/1124/07/11

Keywords

  • Band width
  • Fuze
  • MEMS
  • Microstrip antenna

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