Abstract
The paper provides a novel low-pass filter by using the through-silicon-via (TSV) based 3D integration technology. It is designed based on a typical low-pass Butterworth filter, which consists of two inductors and one capacitor. In order to reduce the consumination of chip area, both the inductor and the capacitor are desinged based on the TSV techniques. Simulation results have validated that the proposed passband filter, working in the frequency range from DC to 3GHz, can provide good working performance.
Original language | English |
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Title of host publication | 2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9798350338874 |
DOIs | |
Publication status | Published - 2023 |
Event | 15th International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Qingdao, China Duration: 14 May 2023 → 17 May 2023 |
Publication series
Name | 2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings |
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Conference
Conference | 15th International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 |
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Country/Territory | China |
City | Qingdao |
Period | 14/05/23 → 17/05/23 |
Keywords
- 3D
- Capacitor
- inductor
- low-pass Butterworth filter
- through-silicon-via (TSV)
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Zhao, Z., Bao, X., Wang, Z., Yuan, H., Li, J., Fang, L., & Sun, H. (2023). Design of a Low-pass Filter Based on the Through-Silicon-Via Structure. In 2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings (2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMMT58241.2023.10276851