@inproceedings{2d33eea34004441b870ed4f3f24bc3c2,
title = "Design of a Low-pass Filter Based on the Through-Silicon-Via Structure",
abstract = "The paper provides a novel low-pass filter by using the through-silicon-via (TSV) based 3D integration technology. It is designed based on a typical low-pass Butterworth filter, which consists of two inductors and one capacitor. In order to reduce the consumination of chip area, both the inductor and the capacitor are desinged based on the TSV techniques. Simulation results have validated that the proposed passband filter, working in the frequency range from DC to 3GHz, can provide good working performance.",
keywords = "3D, Capacitor, inductor, low-pass Butterworth filter, through-silicon-via (TSV)",
author = "Zhibo Zhao and Xiue Bao and Zeyu Wang and Haoyun Yuan and Jinkai Li and Lili Fang and Houjun Sun",
note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 15th International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 ; Conference date: 14-05-2023 Through 17-05-2023",
year = "2023",
doi = "10.1109/ICMMT58241.2023.10276851",
language = "English",
series = "2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 International Conference on Microwave and Millimeter Wave Technology, ICMMT 2023 - Proceedings",
address = "United States",
}