@inproceedings{5836624cb57743adabc74cc153a0e202,
title = "Design and fabrication of an integrated CMOS-MEMS 3-axis accelerometer",
abstract = "A monolithic integrated CMOS-MEMS three-axis accelerometer has been designed and fabricated. The sensor is a single structure that uses sidewall capacitors of comb fingers to sense acceleration in all three directions. The sensor plus on-chip CMOS circuitry is about 1mm by 1mm in size and is fabricated by a post-CMOS micromachining process that uses interconnect metal layers as etching mask and has only dry-etch steps involved. The sensor structure incorporates both thin-film structures and bulk Si structures to achieve three-axis acceleration sensing without any extra masks, material deposition or wafer bonding. Both behavioral simulaton and finite element simulation were conducted to verify and optimize the sensor design. A noise floor of 50 μg/Hz 1/2 can be achieved.",
keywords = "3-axis accelerometer, CMOS-MEMS, Integrated accelerometer, Vertical comb finger sensing",
author = "Huikai Xie and Fedder, {Gary K.} and Zhiyu Pan and Wilhelm Frey",
year = "2003",
language = "English",
isbn = "0972842209",
series = "2003 Nanotechnology Conference and Trade Show - Nanotech 2003",
pages = "420--423",
editor = "M. Laudon and B. Romanowicz",
booktitle = "2003 Nanotechnology Conference and Trade Show - Nanotech 2003",
note = "2003 Nanotechnology Conference and Trade Show - Nanotech 2003 ; Conference date: 23-02-2003 Through 27-02-2003",
}