Defect Analysis in Microgroove Machining of Nickel-Phosphide Plating by Small Cross-Angle Microgrooving

Xiaobin Dong, Tianfeng Zhou*, Siqin Pang, Zhiqiang Liang, Qian Yu, Benshuai Ruan, Xibin Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

Crystalline nickel-phosphide (c-Ni-P) plating is a newly developed mold material for precision glass molding (PGM) to fabricate microgrooves. In the ultraprecision cutting process of the c-Ni-P plating material, the neighboring microgrooves are required to adjoin with each other to ensure acute microgroove ridges and miniaturize the microgroove size. Generally, defects of burrs and fracture pits can easily occur on the ridges when the plating layer is grooved. Burrs appear when tears dominate in material removal with a large adjacent amount. With the change of the adjacent amount, the removed material is sheared out from the workpiece, and when the cutting depth of the groove ridge is over the brittle-ductile transition thickness, fracture pits arise. To restrict these defects, a small cross-angle microgrooving method is proposed to test the critical adjacent amount range efficiently. It is found that an acute ridge of the microgroove is formed with a small enough adjacent amount; when this amount is in the range of 570 nm720 nm in the microgroove machining process, fracture pits begin to arise on the gradient edge. High-quality microgrooves can be obtained based on this methodology.

Original languageEnglish
Article number1478649
JournalJournal of Nanomaterials
Volume2018
DOIs
Publication statusPublished - 2018

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