Abstract
1.25 mm gate-width GaN HEMT and 12 mm gate-width GaN microwave power amplifier fabricated by Nanjing Electronic Devices Institute were chosen for the test. The DC working reliability of the 1.25 mm gate-width GaN HEMT was evaluated by using three-temperature accelerated life testing, and the results showed that the failure probability was 1. 86×10-9/h at the channel temperature of 125℃; The RF working reliability of the 12 mm gate-width GaN HEMT was evaluated by using RF accelerated life testing, and the results showed that the failure probability was less than 1.02×10-7/h at the channel temperature of 125℃.
Original language | English |
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Pages (from-to) | 217-220 and 252 |
Journal | Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics |
Volume | 35 |
Issue number | 3 |
Publication status | Published - 25 Jun 2015 |
Externally published | Yes |
Keywords
- Accelerated life test
- GaN
- High electron mobility transistor(HEMT)
- Microwave power device