DC and RF accelerated life testing of GaN microwave power device

Yang Yang*, Bo Xu, Dongming Jia, Hao Jiang, Shi Yao, Tangsheng Chen, Feng Qian

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

1.25 mm gate-width GaN HEMT and 12 mm gate-width GaN microwave power amplifier fabricated by Nanjing Electronic Devices Institute were chosen for the test. The DC working reliability of the 1.25 mm gate-width GaN HEMT was evaluated by using three-temperature accelerated life testing, and the results showed that the failure probability was 1. 86×10-9/h at the channel temperature of 125℃; The RF working reliability of the 12 mm gate-width GaN HEMT was evaluated by using RF accelerated life testing, and the results showed that the failure probability was less than 1.02×10-7/h at the channel temperature of 125℃.

Original languageEnglish
Pages (from-to)217-220 and 252
JournalGuti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics
Volume35
Issue number3
Publication statusPublished - 25 Jun 2015
Externally publishedYes

Keywords

  • Accelerated life test
  • GaN
  • High electron mobility transistor(HEMT)
  • Microwave power device

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