Abstract
Purpose: This paper aims to study a high-temperature (up to 200 °C) data acquisition and processing circuit for logging. Design/methodology/approach: With the decrease in thermal resistance by system-in package technology and exquisite power consumption distribution design, the circuit worked well at high temperatures environment from both theoretical analysis and real experiments evaluation. Findings: In thermal simulation, considering on board chips’ power consumption as additional heat source, the highest temperature point reached by all the chips in the circuit is only 211 °C at work temperature of 200 °C. In addition, the proposed circuit was validated by long time high-temperature experiments. The circuit showed good dynamic performance during a 4-h test in a 200-°C oven, and maintained a signal-to-noise ratio of 92.54 dB, a signal-to-noise and distortion ratio of 91.81 dB, a total harmonic distortion of −99.89 dB and a spurious free dynamic range of 100.28 dB. Originality/value: The proposed circuit and methodology showed great potential for application in deep-well logging systems and other high-temperature situations.
Original language | English |
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Pages (from-to) | 131-138 |
Number of pages | 8 |
Journal | Microelectronics International |
Volume | 37 |
Issue number | 3 |
DOIs | |
Publication status | Published - 11 Jun 2020 |
Keywords
- Data acquisition and processing
- High temperature
- Logging
- System-in-package
- Thermal simulation