Data acquisition and processing circuit for high-temperature logging up to 200°C

Jingxuan Peng, Jingjing Cheng, Lei Wu*, Qiong Li

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

Purpose: This paper aims to study a high-temperature (up to 200 °C) data acquisition and processing circuit for logging. Design/methodology/approach: With the decrease in thermal resistance by system-in package technology and exquisite power consumption distribution design, the circuit worked well at high temperatures environment from both theoretical analysis and real experiments evaluation. Findings: In thermal simulation, considering on board chips’ power consumption as additional heat source, the highest temperature point reached by all the chips in the circuit is only 211 °C at work temperature of 200 °C. In addition, the proposed circuit was validated by long time high-temperature experiments. The circuit showed good dynamic performance during a 4-h test in a 200-°C oven, and maintained a signal-to-noise ratio of 92.54 dB, a signal-to-noise and distortion ratio of 91.81 dB, a total harmonic distortion of −99.89 dB and a spurious free dynamic range of 100.28 dB. Originality/value: The proposed circuit and methodology showed great potential for application in deep-well logging systems and other high-temperature situations.

Original languageEnglish
Pages (from-to)131-138
Number of pages8
JournalMicroelectronics International
Volume37
Issue number3
DOIs
Publication statusPublished - 11 Jun 2020

Keywords

  • Data acquisition and processing
  • High temperature
  • Logging
  • System-in-package
  • Thermal simulation

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