Curing reaction kinetics of HTPB/TDI bonding system

Xing Yu Wu, Qing Zhong Cui*, Jun Xu

*Corresponding author for this work

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Abstract

To solve the problem on end point of curing encountered in engineering application, the curing reaction kinetics of hydroxyl-terminated polybutadiene (HTPB) type bonding system used for polymer bonded explosive (PBX) wss studied by isothermal and non-isothermal differential scanning calorimetry (DSC) through the simulation of n-order reaction kinetic model according to Kissinger method and Crane method. Results show that the apparent activation energy, reaction order, pre-exponential factor and curing reaction heat for curing reaction of HTPB/TDI bonding system are 54.61 kJ·mol-1, 0.87, 192.80 s-1 and 482.87 J·g-1, respectively. Autocatalytic phenomenon exists in the curing reaction process of the system. After adding the dibutytin dilaureate (T12) catalyst, the curing reaction rate of the bonding system increases and the reaction temperature decreases. The function relation between the curing temperature and the curing time is fitted and obtained. Calculated curing time is about 3.91 days when the curing temperature is 60℃, which is consistent with 4-6 days in the practical engineering applications.

Original languageEnglish
Pages (from-to)1097-1101
Number of pages5
JournalHanneng Cailiao/Chinese Journal of Energetic Materials
Volume24
Issue number11
DOIs
Publication statusPublished - 25 Nov 2016

Keywords

  • Bonding system
  • Catalytic reaction
  • Curing reaction kinetics
  • Differential scanning calorimety
  • Hydroxyl-terminated polybutadiene (HTPB)
  • Polymer bonder explosives (PBX)

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Wu, X. Y., Cui, Q. Z., & Xu, J. (2016). Curing reaction kinetics of HTPB/TDI bonding system. Hanneng Cailiao/Chinese Journal of Energetic Materials, 24(11), 1097-1101. https://doi.org/10.11943/j.issn.1006-9941.2016.11.012