Characterization of high-temperature ceramic materials at microwave frequencies for MEMS applications

Xinhua Ren*, Tao Jiang, Yiguang Wang, Linan An, Xun Gong

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

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Abstract

In this paper, the dielectric constant and loss tangent of two new high-temperature ceramic materials, SiCN and AIP04, are characterized using a novel measurement technique at microwave frequencies with high accuracy. These ceramic materials exhibit high thermal stabilities and corrosion resistance, enabling their use for high-temperature sensing applications. The dielectric properties of these ceramic materials are critical parameters in order to develop high-tern perature sensors for turbine engines. It is found that the dielectric constant and loss tangent of SiCN are 4.358 and 5.26 × 10 -3, respectively. For AlPO4, the two parameters are 2.637 and 4.23 × 10-3, respectively. The standard deviation is less than 0.58% for the dielectric constant measurement and less than 5.72% for the loss tangent measurement, demonstrating excellent measurement repeatability.

Original languageEnglish
Title of host publication2009 IEEE 10th Annual Wireless and Microwave Technology Conference, WAMICON 2009
DOIs
Publication statusPublished - 2009
Externally publishedYes
Event2009 IEEE 10th Annual Wireless and Microwave Technology Conference, WAMICON 2009 - Clearwater, FL, United States
Duration: 20 Apr 200921 Apr 2009

Publication series

Name2009 IEEE 10th Annual Wireless and Microwave Technology Conference, WAMICON 2009

Conference

Conference2009 IEEE 10th Annual Wireless and Microwave Technology Conference, WAMICON 2009
Country/TerritoryUnited States
CityClearwater, FL
Period20/04/0921/04/09

Keywords

  • Ceramic
  • Dielectric constant
  • High temperature
  • Loss tangent
  • Waveguide cavity

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Ren, X., Jiang, T., Wang, Y., An, L., & Gong, X. (2009). Characterization of high-temperature ceramic materials at microwave frequencies for MEMS applications. In 2009 IEEE 10th Annual Wireless and Microwave Technology Conference, WAMICON 2009 Article 5207277 (2009 IEEE 10th Annual Wireless and Microwave Technology Conference, WAMICON 2009). https://doi.org/10.1109/WAMICON.2009.5207277