TY - JOUR
T1 - Bilayer lattice structure integrated with phase change material for innovative thermal protection system design
AU - Chen, Junwei
AU - Hu, Li
AU - Wu, Jing
AU - Yan, Zhihong
AU - Chen, Yanfei
AU - He, Chunwang
AU - Ai, Shigang
N1 - Publisher Copyright:
© 2023 Elsevier Masson SAS
PY - 2023/10
Y1 - 2023/10
N2 - In recent years, ceramic matrix composite (CMC) lattice structure has become a promising candidate for a new generation of integrated thermal protection systems (ITPSs) used in the ultrahigh-temperature environment. However, the thermal short circuit effect caused by lattice cores limits their application. In this work, we propose a bilayer CMC lattice structure filled with phase change material (PCM) and thermal insulation material for integrated thermal protection systems (ITPSs) to mitigate the thermal short circuit effect. The numerical simulation method is used to verify the effectiveness of the bilayer lattice structure in mitigating the thermal short circuit effect compared with one-layer ITPS. By inserting the middle face sheet, the thermal insulation effect enhances about 16%. Furthermore, the effects of thermal insulation materials, thermal conductivity and thickness of paraffin/expanded graphite composite PCM, and the diameter of the lattice core strut on the thermal insulation performance are discussed. The results show that the thickness of PCM has an optimal solution. Optimizing results show that when the aerogel insulation fiber is used as the thermal insulation material, the thermal conductivity k=0.82 W/(m⋅K) and the thickness t3=10 mm of PCM, the diameter of the core strut d=1.5 mm, the bilayer PCM-ITPS has the best thermal insulation performance. When the ultrahigh-temperature load is continuously loaded, the highest temperature of Top Face Sheet is more than 2300 °C, but the highest temperature of Bottom Face Sheet is only 30.12 °C, which thermal insulation effect is far better than the traditional ITPS. This work gives a novel scheme to solve the thermal short circuit effect, improving the thermal protection performance and accelerate the application of lattice structure in ITPS.
AB - In recent years, ceramic matrix composite (CMC) lattice structure has become a promising candidate for a new generation of integrated thermal protection systems (ITPSs) used in the ultrahigh-temperature environment. However, the thermal short circuit effect caused by lattice cores limits their application. In this work, we propose a bilayer CMC lattice structure filled with phase change material (PCM) and thermal insulation material for integrated thermal protection systems (ITPSs) to mitigate the thermal short circuit effect. The numerical simulation method is used to verify the effectiveness of the bilayer lattice structure in mitigating the thermal short circuit effect compared with one-layer ITPS. By inserting the middle face sheet, the thermal insulation effect enhances about 16%. Furthermore, the effects of thermal insulation materials, thermal conductivity and thickness of paraffin/expanded graphite composite PCM, and the diameter of the lattice core strut on the thermal insulation performance are discussed. The results show that the thickness of PCM has an optimal solution. Optimizing results show that when the aerogel insulation fiber is used as the thermal insulation material, the thermal conductivity k=0.82 W/(m⋅K) and the thickness t3=10 mm of PCM, the diameter of the core strut d=1.5 mm, the bilayer PCM-ITPS has the best thermal insulation performance. When the ultrahigh-temperature load is continuously loaded, the highest temperature of Top Face Sheet is more than 2300 °C, but the highest temperature of Bottom Face Sheet is only 30.12 °C, which thermal insulation effect is far better than the traditional ITPS. This work gives a novel scheme to solve the thermal short circuit effect, improving the thermal protection performance and accelerate the application of lattice structure in ITPS.
KW - Bilayer lattice structure
KW - Composite phase change materials
KW - Integrated thermal insulation system
KW - Thermal short circuit effect
KW - Ultrahigh-temperature
UR - http://www.scopus.com/inward/record.url?scp=85169540962&partnerID=8YFLogxK
U2 - 10.1016/j.ast.2023.108576
DO - 10.1016/j.ast.2023.108576
M3 - Article
AN - SCOPUS:85169540962
SN - 1270-9638
VL - 141
JO - Aerospace Science and Technology
JF - Aerospace Science and Technology
M1 - 108576
ER -