Application in RTM of the vinyl ester resin curing kinetics

Xiaolin Zhao; Jianhua Du; Heng Gao; Tao Fan; Hui Li; Dafeng Wang; Yingying Lv; Chengchang Jia

Application in RTM of the vinyl ester resin curing kinetics

Xiaolin Zhao, Jianhua Du^*, Heng Gao, Tao Fan, Hui Li, Dafeng Wang, Yingying Lv, Chengchang Jia

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Abstract

The cure technology of bisphenol A type vinyl ester resin system applying to RTM was studied by differential scanning calorimetry (DSC). The curing reaction equation of the resin system was ascertained by Kissinger and Crane equations. The equation was t=1-[1-5 584.65exp(-4 352.90/T)t]^6.67. Gelling temperature, curing temperature and post-treating temperature were calculated by extrapolating Ttemperature-Heating rate (T-β) curves and were 61.66℃, 74.55℃, 95.49℃, respectively. In practice, due to internal heat of reaction, applicable temperature need to reduce. The curing reaction equation and cure parameters have great significance for Resin Transfer Molding (RTM) process.

Original language	English
Pages (from-to)	336-340
Number of pages	5
Journal	Fenmo Yejin Jishu/Powder Metallurgy Technology
Volume	34
Issue number	5
Publication status	Published - 27 Oct 2016
Externally published	Yes

Keywords

Cure kinetics
DSC
Vinyl ester resin

Cite this

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title = "Application in RTM of the vinyl ester resin curing kinetics",

abstract = "The cure technology of bisphenol A type vinyl ester resin system applying to RTM was studied by differential scanning calorimetry (DSC). The curing reaction equation of the resin system was ascertained by Kissinger and Crane equations. The equation was t=1-[1-5 584.65exp(-4 352.90/T)t]6.67. Gelling temperature, curing temperature and post-treating temperature were calculated by extrapolating Ttemperature-Heating rate (T-β) curves and were 61.66℃, 74.55℃, 95.49℃, respectively. In practice, due to internal heat of reaction, applicable temperature need to reduce. The curing reaction equation and cure parameters have great significance for Resin Transfer Molding (RTM) process.",

keywords = "Cure kinetics, DSC, Vinyl ester resin",

author = "Xiaolin Zhao and Jianhua Du and Heng Gao and Tao Fan and Hui Li and Dafeng Wang and Yingying Lv and Chengchang Jia",

year = "2016",

month = oct,

day = "27",

language = "English",

volume = "34",

pages = "336--340",

journal = "Fenmo Yejin Jishu/Powder Metallurgy Technology",

issn = "1001-3784",

publisher = "University of Science and Technology Beijing",

number = "5",

}

TY - JOUR

T1 - Application in RTM of the vinyl ester resin curing kinetics

AU - Zhao, Xiaolin

AU - Du, Jianhua

AU - Gao, Heng

AU - Fan, Tao

AU - Li, Hui

AU - Wang, Dafeng

AU - Lv, Yingying

AU - Jia, Chengchang

PY - 2016/10/27

Y1 - 2016/10/27

N2 - The cure technology of bisphenol A type vinyl ester resin system applying to RTM was studied by differential scanning calorimetry (DSC). The curing reaction equation of the resin system was ascertained by Kissinger and Crane equations. The equation was t=1-[1-5 584.65exp(-4 352.90/T)t]6.67. Gelling temperature, curing temperature and post-treating temperature were calculated by extrapolating Ttemperature-Heating rate (T-β) curves and were 61.66℃, 74.55℃, 95.49℃, respectively. In practice, due to internal heat of reaction, applicable temperature need to reduce. The curing reaction equation and cure parameters have great significance for Resin Transfer Molding (RTM) process.

AB - The cure technology of bisphenol A type vinyl ester resin system applying to RTM was studied by differential scanning calorimetry (DSC). The curing reaction equation of the resin system was ascertained by Kissinger and Crane equations. The equation was t=1-[1-5 584.65exp(-4 352.90/T)t]6.67. Gelling temperature, curing temperature and post-treating temperature were calculated by extrapolating Ttemperature-Heating rate (T-β) curves and were 61.66℃, 74.55℃, 95.49℃, respectively. In practice, due to internal heat of reaction, applicable temperature need to reduce. The curing reaction equation and cure parameters have great significance for Resin Transfer Molding (RTM) process.

KW - Cure kinetics

KW - DSC

KW - Vinyl ester resin

UR - http://www.scopus.com/inward/record.url?scp=85017262651&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:85017262651

SN - 1001-3784

VL - 34

SP - 336

EP - 340

JO - Fenmo Yejin Jishu/Powder Metallurgy Technology

JF - Fenmo Yejin Jishu/Powder Metallurgy Technology

IS - 5

ER -

Application in RTM of the vinyl ester resin curing kinetics

Abstract

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