Anti-impact material properties of UV-LIGA multi-layered electroformed nickel

Zhi Jian Zhou*, Wei Rong Nie, Zhan Wen Xi, Xiao Feng Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

To explore the mechanical reliability of multi-layered electroformed nickel prepared by UV-LIGA (Ultraviolet Lithography, Galvanoformung, Abformung) multi-layered manufacturing technology, the anti-impact material properties of the multi-layered electroformed nickel were analyzed. High-speed impact tests for the multi-layered electroformed nickel were completed by adopting an impact testing device and a signal acquisition system. The experimental results show that the cumulative failure probability - peak acceleration curve approximately fits the Weibull statistical distribution, the Weibull coefficient is 7.6 and the reference acceleration is 21 300g. When the acceleration is 12 000-18 000g, it shows a higher reliability; when that is 12000-18 000g, the cumulative failure probability increases greatly; however the reliability is declines rapidly at acceleration more than 24000g. A Scanning Electron Microscopy(SEM) was used to observe the samples and the results show that the delamination, fracture, plastic deformation and adhesion are the main failure modes. Finally, the failure causes were analyzed and corresponding optimization methods were proposed to improve the process of UV-LIGA multi-layered electroformed nickel, which verifies that the experiments provide bases for design of a multi layer structure of UV-LIGA.

Original languageEnglish
Pages (from-to)1044-1052
Number of pages9
JournalGuangxue Jingmi Gongcheng/Optics and Precision Engineering
Volume23
Issue number4
DOIs
Publication statusPublished - 1 Apr 2015
Externally publishedYes

Keywords

  • Anti-impact property
  • Micro-mechanic-electronic System(MEMS)
  • Multi-layered electroformed nickel
  • Ultraviolet Lithography Galvanoformung Abformung(UV-LIGA)

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