Analyse of the structure of high g-force MEMS accelerometer

Ping Song; Kejie Li; Gengchen Shi

doi:10.1117/12.440208

Analyse of the structure of high g-force MEMS accelerometer

Ping Song^*, Kejie Li, Gengchen Shi

^*Corresponding author for this work

School of Mechatronical Engineering

Beijing Institute of Technology

Research output: Contribution to journal › Conference article › peer-review

Abstract

The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.

Original language	English
Pages (from-to)	273-275
Number of pages	3
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4414
DOIs	https://doi.org/10.1117/12.440208
Publication status	Published - 2001
Event	International Conference on Sensor Technology (ISTC 2001) - Wuhan, China Duration: 10 Oct 2001 → 12 Oct 2001

Keywords

High g-force
MEMS accelerometer

Access to Document

10.1117/12.440208

Cite this

Song, P., Li, K., & Shi, G. (2001). Analyse of the structure of high g-force MEMS accelerometer. Proceedings of SPIE - The International Society for Optical Engineering, 4414, 273-275. https://doi.org/10.1117/12.440208

@article{9bfce8ea10814396aaaac0ce6beee873,

title = "Analyse of the structure of high g-force MEMS accelerometer",

abstract = "The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.",

keywords = "High g-force, MEMS accelerometer",

author = "Ping Song and Kejie Li and Gengchen Shi",

year = "2001",

doi = "10.1117/12.440208",

language = "English",

volume = "4414",

pages = "273--275",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "International Conference on Sensor Technology (ISTC 2001) ; Conference date: 10-10-2001 Through 12-10-2001",

}

TY - JOUR

T1 - Analyse of the structure of high g-force MEMS accelerometer

AU - Song, Ping

AU - Li, Kejie

AU - Shi, Gengchen

PY - 2001

Y1 - 2001

N2 - The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.

AB - The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.

KW - High g-force

KW - MEMS accelerometer

UR - http://www.scopus.com/inward/record.url?scp=0035759430&partnerID=8YFLogxK

U2 - 10.1117/12.440208

DO - 10.1117/12.440208

M3 - Conference article

AN - SCOPUS:0035759430

SN - 0277-786X

VL - 4414

SP - 273

EP - 275

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - International Conference on Sensor Technology (ISTC 2001)

Y2 - 10 October 2001 through 12 October 2001

ER -

Analyse of the structure of high g-force MEMS accelerometer

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this