Analyse of the structure of high g-force MEMS accelerometer

Ping Song; Kejie Li; Gengchen Shi

doi:10.1117/12.440208

Analyse of the structure of high g-force MEMS accelerometer

Ping Song^*, Kejie Li, Gengchen Shi

^*Corresponding author for this work

School of Mechatronical Engineering

Beijing Institute of Technology

Research output: Contribution to journal › Conference article › peer-review

Abstract

The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.

Original language	English
Pages (from-to)	273-275
Number of pages	3
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4414
DOIs	https://doi.org/10.1117/12.440208
Publication status	Published - 2001
Event	International Conference on Sensor Technology (ISTC 2001) - Wuhan, China Duration: 10 Oct 2001 → 12 Oct 2001

Keywords

High g-force
MEMS accelerometer

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10.1117/12.440208

Cite this

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title = "Analyse of the structure of high g-force MEMS accelerometer",

abstract = "The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.",

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author = "Ping Song and Kejie Li and Gengchen Shi",

year = "2001",

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journal = "Proceedings of SPIE - The International Society for Optical Engineering",

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AU - Song, Ping

AU - Li, Kejie

AU - Shi, Gengchen

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AB - The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.

KW - High g-force

KW - MEMS accelerometer

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U2 - 10.1117/12.440208

DO - 10.1117/12.440208

M3 - Conference article

AN - SCOPUS:0035759430

SN - 0277-786X

VL - 4414

SP - 273

EP - 275

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - International Conference on Sensor Technology (ISTC 2001)

Y2 - 10 October 2001 through 12 October 2001

ER -

Analyse of the structure of high g-force MEMS accelerometer

Abstract

Keywords

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