An improved correlation for void fraction during in-tube condensation

Cong Guo, Tao Wang*, Yuyan Jiang, Chaohong Guo, Miao Zeng, Dong Yu, Dawei Tang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A comprehensive literature research was undertaken for the available void fraction correlations and experimental void fraction data during condensation inside tubes. Comparisons between the correlations showed that slip ratio models were probably more suitable for the determination of void fraction at low mass velocity when the slip ratio was chosen appropriately. For high mass velocity, there was no apparent difference for the predictions of various models. In addition, the Froude rate parameter (dimensionless number) can be used for representing the flow characteristics during condensation inside tube and was defined in terms of mass flux and quality. Based on the observations made, a new correlation was developed through the weighted average method without resorting back to very complex expressions. This correlation was a simple model and obtained involving with the Froude rate parameter and slip ratio models. The improved correlation has been shown to be in good agreement with data ranging from low mass velocity up to very high mass velocity.

Original languageEnglish
Title of host publicationASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791856871
DOIs
Publication statusPublished - 2015
Externally publishedYes
EventASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, United States
Duration: 6 Jul 20159 Jul 2015

Publication series

NameASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Conference

ConferenceASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Country/TerritoryUnited States
CitySan Francisco
Period6/07/159/07/15

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