An analytical electrothermal model of a 1-D electrothermal MEMS micromirror

Shane T. Todd*, Huikai Xie

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

6 Citations (Scopus)

Abstract

We have developed an analytical model that describes the steady-state thermal behavior of a 1-D electrothermal bimorph MEMS micromirror. The steady-state 1-D heat transport equation is used to solve for the temperature distribution of the device upon actuation. Three models are developed using different thermal conditions on the device. The models consider heat dissipation from conduction and convection and the temperature dependence of the actuator electrical resistor. The temperature distribution equation of each model is analyzed to find critical thermal parameters such as the position of maximum temperature, maximum temperature, average temperature, and equivalent thermal resistance. The simplest model, called the Case 1 model, is used to develop an electrothermal lumped element model that uses a single thermal power source. In the Case 1 model, it is shown that a parameter called the "balancing factor" predicts where the maximum temperature is located, the distribution of power flow, and the division of thermal resistances. The analytical models are compared to FEM simulations and agree within 20% for all of the actuation ranges and thermal conditions tested.

Original languageEnglish
Article number81
Pages (from-to)344-353
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5649
Issue numberPART 1
DOIs
Publication statusPublished - 2005
Externally publishedYes
EventSmart Structures, Devices, and Systems II - Sydney, Australia
Duration: 13 Dec 200415 Dec 2004

Keywords

  • Electrothermal actuation
  • Heat transport
  • Lumped element modeling
  • MEMS
  • Micromirror

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