Abstract
A virtual 3-D extractor of the single dielectric is presented in this paper. In the indirect boundary integral equations, the plane charge distribution on the surface of conductors is replaced with a mesh charge distribution, and we use the multipole-accelerated algorithm to further depress the computational complexity. Numerical results show that its computational complexity is about O(n), where n is the number of the discrete variables. Within the comparable accuracy, it runs several times faster than Fastcap, which is presently a very advanced multipole-accelerated parasitic capacitance extractor.
Original language | English |
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Title of host publication | Proceedings of the ASP-DAC 2001 |
Subtitle of host publication | Asia and South Pacific Design Automation Conference 2001 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 214-217 |
Number of pages | 4 |
ISBN (Electronic) | 0780366336 |
DOIs | |
Publication status | Published - 2001 |
Externally published | Yes |
Event | Asia and South Pacific Design Automation Conference 2001, ASP-DAC 2001 - Yokohama, Japan Duration: 30 Jan 2001 → 2 Feb 2001 |
Publication series
Name | Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC |
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Volume | 2001-January |
Conference
Conference | Asia and South Pacific Design Automation Conference 2001, ASP-DAC 2001 |
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Country/Territory | Japan |
City | Yokohama |
Period | 30/01/01 → 2/02/01 |
Keywords
- Acceleration
- Computational complexity
- Computer science
- Conductors
- Delay
- Integral equations
- Integrated circuit interconnections
- Parasitic capacitance
- Very large scale integration
- Wires
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Yang, Z., Wang, Z., & Fang, S. (2001). A virtual 3-D multipole accelerated extractor for VLSI parasitic interconnect capacitance. In Proceedings of the ASP-DAC 2001: Asia and South Pacific Design Automation Conference 2001 (pp. 214-217). Article 913307 (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC; Vol. 2001-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2001.913307