A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators

Jicong Zhao; Quan Yuan; Wei Luo; Xiao Kan; Jinying Zhang; Jinling Yang; Fuhua Yang

doi:10.1109/MEMSYS.2016.7421690

A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators

Jicong Zhao, Quan Yuan, Wei Luo, Xiao Kan, Jinying Zhang, Jinling Yang^*, Fuhua Yang

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper presents a vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. Sn-rich Au-Sn solder bonding is used to achieve reliable hermetic packaging with high shear strength. An equivalent circuit model of the packaged resonator is established to analyze the parasitic effect caused by encapsulation. Reduction of the parasitic effect is achieved via grounding sealing ring, and decreasing overlap between sealing ring and VHF traces. The measured frequency spectrum of a packaged resonator was not distorted by parasitic effect, which was well consistent with the simulation result. Besides, the Q values of the resonator increase from 6600 to 10400 due to vacuum encapsulation.

Original language	English
Title of host publication	MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	573-576
Number of pages	4
ISBN (Electronic)	9781509019731
DOIs	https://doi.org/10.1109/MEMSYS.2016.7421690
Publication status	Published - 26 Feb 2016
Externally published	Yes
Event	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China Duration: 24 Jan 2016 → 28 Jan 2016

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume	2016-February
ISSN (Print)	1084-6999

Conference

Conference	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Country/Territory	China
City	Shanghai
Period	24/01/16 → 28/01/16

Access to Document

10.1109/MEMSYS.2016.7421690

Cite this

Zhao, J., Yuan, Q., Luo, W., Kan, X., Zhang, J., Yang, J., & Yang, F. (2016). A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. In MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems (pp. 573-576). Article 7421690 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2016-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2016.7421690

Zhao, Jicong ; Yuan, Quan ; Luo, Wei et al. / A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 573-576 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{8cf02e6e1ee74fb481e9061e71ad11cc,

title = "A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators",

abstract = "This paper presents a vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. Sn-rich Au-Sn solder bonding is used to achieve reliable hermetic packaging with high shear strength. An equivalent circuit model of the packaged resonator is established to analyze the parasitic effect caused by encapsulation. Reduction of the parasitic effect is achieved via grounding sealing ring, and decreasing overlap between sealing ring and VHF traces. The measured frequency spectrum of a packaged resonator was not distorted by parasitic effect, which was well consistent with the simulation result. Besides, the Q values of the resonator increase from 6600 to 10400 due to vacuum encapsulation.",

author = "Jicong Zhao and Quan Yuan and Wei Luo and Xiao Kan and Jinying Zhang and Jinling Yang and Fuhua Yang",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 ; Conference date: 24-01-2016 Through 28-01-2016",

year = "2016",

month = feb,

day = "26",

doi = "10.1109/MEMSYS.2016.7421690",

language = "English",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "573--576",

booktitle = "MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems",

address = "United States",

}

Zhao, J, Yuan, Q, Luo, W, Kan, X, Zhang, J, Yang, J & Yang, F 2016, A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. in MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems., 7421690, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), vol. 2016-February, Institute of Electrical and Electronics Engineers Inc., pp. 573-576, 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016, Shanghai, China, 24/01/16. https://doi.org/10.1109/MEMSYS.2016.7421690

A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. / Zhao, Jicong; Yuan, Quan; Luo, Wei et al.
MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2016. p. 573-576 7421690 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2016-February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators

AU - Zhao, Jicong

AU - Yuan, Quan

AU - Luo, Wei

AU - Kan, Xiao

AU - Zhang, Jinying

AU - Yang, Jinling

AU - Yang, Fuhua

PY - 2016/2/26

Y1 - 2016/2/26

N2 - This paper presents a vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. Sn-rich Au-Sn solder bonding is used to achieve reliable hermetic packaging with high shear strength. An equivalent circuit model of the packaged resonator is established to analyze the parasitic effect caused by encapsulation. Reduction of the parasitic effect is achieved via grounding sealing ring, and decreasing overlap between sealing ring and VHF traces. The measured frequency spectrum of a packaged resonator was not distorted by parasitic effect, which was well consistent with the simulation result. Besides, the Q values of the resonator increase from 6600 to 10400 due to vacuum encapsulation.

AB - This paper presents a vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. Sn-rich Au-Sn solder bonding is used to achieve reliable hermetic packaging with high shear strength. An equivalent circuit model of the packaged resonator is established to analyze the parasitic effect caused by encapsulation. Reduction of the parasitic effect is achieved via grounding sealing ring, and decreasing overlap between sealing ring and VHF traces. The measured frequency spectrum of a packaged resonator was not distorted by parasitic effect, which was well consistent with the simulation result. Besides, the Q values of the resonator increase from 6600 to 10400 due to vacuum encapsulation.

UR - http://www.scopus.com/inward/record.url?scp=84970956416&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2016.7421690

DO - 10.1109/MEMSYS.2016.7421690

M3 - Conference contribution

AN - SCOPUS:84970956416

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 573

EP - 576

BT - MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016

Y2 - 24 January 2016 through 28 January 2016

ER -

Zhao J, Yuan Q, Luo W, Kan X, Zhang J, Yang J et al. A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators. In MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc. 2016. p. 573-576. 7421690. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2016.7421690

A vacuum encapsulation technique with novel parasitic optimization methods for VHF MEMS resonators

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