@inproceedings{02ac9e051ed1482880a151b524759691,
title = "A Terahertz-wave Double-Band Transition from Substrate Integrated Waveguide to Rectangular Waveguide for InP MMIC",
abstract = "A double-band terahertz slot transition from the substrate integrated waveguide (SIW) to the rectangular waveguide (RWG) is presented. With better than 10 dB return loss (RL) and 1.3 dB insertion loss (IL) demonstrated by full-EM simulation, the frequency bands of a designed sample are from 164.6 GHz to 182.76 GHz and from 238 GHz to 257.9 GHz. The presented transition is suitable for multilayer MMIC process, especially for the substrate with high loss and high dielectric constant.",
keywords = "Integrated circuit packaging, Rectangular waveguides, THz circuits, THz technologies, Waveguide transitions",
author = "Songyuan Yang and Weihua Yu and Xinxin Yang and Xin Lv and Herbert Zirath and He, {Zhongxia Simon}",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 1st IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2018 ; Conference date: 21-11-2018 Through 23-11-2018",
year = "2018",
month = jul,
day = "2",
doi = "10.1109/CICTA.2018.8706119",
language = "English",
series = "Proceedings of 2018 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "140--141",
booktitle = "Proceedings of 2018 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2018",
address = "United States",
}