A study of fracture toughness and thermal property of nanostructured Yb2SiO5 environmental barrier coatings

Tao Zheng, Shun Wang, Baosheng Xu*, Zelong Wang, Yiguang Wang

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Abstract

The objective of this study was to examine the characteristics of a nanostructured Yb2SiO5 coating and a conventional Yb2SiO5 coating, both prepared using atmospheric plasma spraying (APS). The investigation focused on the phase composition, microstructure, thermal properties, and fracture toughness of the two types of Yb2SiO5 coatings. The findings revealed that both nanostructured and conventional coatings consisted of Yb2SiO5, Yb2O3, and amorphous phases. The nanostructured Yb2SiO5 coating exhibited lower residual tensile stress compared to the conventional Yb2SiO5 coating, resulting in fewer crack defects in the former. The thermal conductivity of the nanostructured Yb2SiO5 coating ranged from 0.71 to 1.22 W/(m·K) between 200 and 1200 °C, while the conventional Yb2SiO5 coating exhibited a thermal conductivity range of 0.81–1.32 W/(m·K) within the same temperature range. Consequently, the thermal conductivity of the nanostructured Yb2SiO5 coating was lower than that of the conventional counterpart. Furthermore, the presence of nanograins significantly enhanced the fracture toughness of the nanostructured Yb2SiO5 coating, which was found to be 1.7 times greater than that of the conventional Yb2SiO5 coating.

Original languageEnglish
Pages (from-to)4436-4443
Number of pages8
JournalJournal of Materials Research and Technology
Volume26
DOIs
Publication statusPublished - 1 Sept 2023

Keywords

  • Atmospheric plasma spray
  • Environmental barrier coating
  • Fracture toughness
  • Nanostructured YbSiO coating
  • The thermal conductivity

Fingerprint

Dive into the research topics of 'A study of fracture toughness and thermal property of nanostructured Yb2SiO5 environmental barrier coatings'. Together they form a unique fingerprint.

Cite this