A simulation investigation on grinding forces in ultrasonic assisted grinding of ceramics with single abrasive grain by using SPH method

In order to investigate the influence of axial ultrasonic vibration on the grinding force during ultrasonic assisted grinding (UAG) of SiC and Al₂O₃ ceramics, the grinding forces of UAG SiC and Al₂O₃ ceramics with single diamond abrasive grain are simulated by using smoothed particle hydrodynamic (SPH) method. In the simulation, the average undeformed chip thickness is set as the depth of cut. It is found that the average undeformed chip thickness decreases with the increase in ultrasonic amplitude and the decrease in abrasive velocity. The simulation results of grinding forces show that the assistance of axial ultrasonic vibration can effectively reduce the grinding forces, and the higher ultrasonic amplitude has a positive effect on the decrease in grinding forces compared with that during conventional grinding. Under the same grinding parameters, the grinding forces in the grinding of SiC ceramics are larger than those in the grinding of Al₂O₃ ceramics.