TY - GEN
T1 - A Robust Infrared Transducer beyond 2K ×2K Pixels
AU - Li, Defang
AU - Zhang, Jinying
AU - Shi, Qingfeng
AU - Li, Qifeng
AU - Zhao, Dongdong
AU - Li, Zhuo
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/1/25
Y1 - 2021/1/25
N2 - A robust MEMS infrared thin film transducer beyond 2000 ×2000 pixels was proposed and fabricated for the first time. This novel transducer had excellent mechanical stability, time response and state-of-the-art pixel scale. The simulation and measured results of the transient temperature and radiation intensity were well consistent. High resolution infrared image was generated using the robust transducer. These results proved that the robust transducer is promising in infrared image generation of high frame rate, high resolution, and especially in large scale of pixels.
AB - A robust MEMS infrared thin film transducer beyond 2000 ×2000 pixels was proposed and fabricated for the first time. This novel transducer had excellent mechanical stability, time response and state-of-the-art pixel scale. The simulation and measured results of the transient temperature and radiation intensity were well consistent. High resolution infrared image was generated using the robust transducer. These results proved that the robust transducer is promising in infrared image generation of high frame rate, high resolution, and especially in large scale of pixels.
KW - Infrared transducer
KW - infrared image generation
KW - silicon micro cavities
KW - ultra-large scale array
UR - http://www.scopus.com/inward/record.url?scp=85103457716&partnerID=8YFLogxK
U2 - 10.1109/MEMS51782.2021.9375413
DO - 10.1109/MEMS51782.2021.9375413
M3 - Conference contribution
AN - SCOPUS:85103457716
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 923
EP - 926
BT - 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
Y2 - 25 January 2021 through 29 January 2021
ER -