A novel planer transition structure from micro-strip line to waveguide

Hao Luo, Chengran Dai, Yu Xiao, Houjun Sun

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Citations (Scopus)

Abstract

A planer micro-strip to waveguide transition structure is given in this paper. Coupled patch on the bottom of the substrate is excited by the micro-strip feed-line on the top, which realizes the transformation from the TE10 mode in the waveguide to the quasi-TEM mode on the micro-strip line. Modeling and simulation of the structure are conducted for the design by using electromagnetic simulation software HFSS. The measurement of the manufactured structure exhibits an insertion loss less than 0.5dB within 33GHz∼37GHz. Compared to traditional waveguide E-plane probe or H-plane probe transition, this design has properties of low profile and easy integration.

Original languageEnglish
Title of host publicationProceedings of 3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1256-1259
Number of pages4
ISBN (Electronic)9781479943548
DOIs
Publication statusPublished - 18 Dec 2014
Event3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014 - Harbin, China
Duration: 26 Jul 201429 Jul 2014

Publication series

NameProceedings of 3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014

Conference

Conference3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014
Country/TerritoryChina
CityHarbin
Period26/07/1429/07/14

Keywords

  • Coupled patch
  • Mcrostrip gradient transition
  • Micro-strip to waveguide transition
  • Vertical transition

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Luo, H., Dai, C., Xiao, Y., & Sun, H. (2014). A novel planer transition structure from micro-strip line to waveguide. In Proceedings of 3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014 (pp. 1256-1259). Article 6992746 (Proceedings of 3rd Asia-Pacific Conference on Antennas and Propagation, APCAP 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APCAP.2014.6992746