@inproceedings{75b7428ea8c449859924299859a7508b,
title = "A Novel Out-of-Plane Electrothermal Bistable Microactuator",
abstract = "This paper reports an out-of-plane bistable electrothermal microactautor that is comprised of inverted-series-connected (ISC) Cu/W-based multimorphs. S-shaped ISC multimorphs have been previously employed for generating large vertical displacement. In this work, the ISC multimorphs have been engineered into a warped shape via pre-stressed W and unbalanced SiO2 encapsulation layers. Electrothermal bistable actuators based on the warped ISC multimorphs have been fabricated and tested. A bistable vertical displacement of 25 μm has been obtained.",
keywords = "Bimorph, bistable, electrothermal actuation, multimorph, out-of-plane movement, stress engineering",
author = "Liang Zhou and Huikai Xie",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII ; Conference date: 23-06-2019 Through 27-06-2019",
year = "2019",
month = jun,
doi = "10.1109/TRANSDUCERS.2019.8808360",
language = "English",
series = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1953--1956",
booktitle = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",
address = "United States",
}