A Novel Out-of-Plane Electrothermal Bistable Microactuator

Liang Zhou; Huikai Xie

doi:10.1109/TRANSDUCERS.2019.8808360

A Novel Out-of-Plane Electrothermal Bistable Microactuator

Liang Zhou, Huikai Xie

University of Florida

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Citations (Scopus)

Abstract

This paper reports an out-of-plane bistable electrothermal microactautor that is comprised of inverted-series-connected (ISC) Cu/W-based multimorphs. S-shaped ISC multimorphs have been previously employed for generating large vertical displacement. In this work, the ISC multimorphs have been engineered into a warped shape via pre-stressed W and unbalanced SiO₂ encapsulation layers. Electrothermal bistable actuators based on the warped ISC multimorphs have been fabricated and tested. A bistable vertical displacement of 25 μm has been obtained.

Original language	English
Title of host publication	2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1953-1956
Number of pages	4
ISBN (Electronic)	9781728120072
DOIs	https://doi.org/10.1109/TRANSDUCERS.2019.8808360
Publication status	Published - Jun 2019
Externally published	Yes
Event	20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII - Berlin, Germany Duration: 23 Jun 2019 → 27 Jun 2019

Publication series

Name	2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

Conference

Conference	20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Country/Territory	Germany
City	Berlin
Period	23/06/19 → 27/06/19

Keywords

Bimorph
bistable
electrothermal actuation
multimorph
out-of-plane movement
stress engineering

Access to Document

10.1109/TRANSDUCERS.2019.8808360

Cite this

Zhou, L., & Xie, H. (2019). A Novel Out-of-Plane Electrothermal Bistable Microactuator. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII (pp. 1953-1956). Article 8808360 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2019.8808360

Zhou, Liang ; Xie, Huikai. / A Novel Out-of-Plane Electrothermal Bistable Microactuator. 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 1953-1956 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

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title = "A Novel Out-of-Plane Electrothermal Bistable Microactuator",

abstract = "This paper reports an out-of-plane bistable electrothermal microactautor that is comprised of inverted-series-connected (ISC) Cu/W-based multimorphs. S-shaped ISC multimorphs have been previously employed for generating large vertical displacement. In this work, the ISC multimorphs have been engineered into a warped shape via pre-stressed W and unbalanced SiO2 encapsulation layers. Electrothermal bistable actuators based on the warped ISC multimorphs have been fabricated and tested. A bistable vertical displacement of 25 μm has been obtained.",

keywords = "Bimorph, bistable, electrothermal actuation, multimorph, out-of-plane movement, stress engineering",

author = "Liang Zhou and Huikai Xie",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII ; Conference date: 23-06-2019 Through 27-06-2019",

year = "2019",

month = jun,

doi = "10.1109/TRANSDUCERS.2019.8808360",

language = "English",

series = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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booktitle = "2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII",

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Zhou, L & Xie, H 2019, A Novel Out-of-Plane Electrothermal Bistable Microactuator. in 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII., 8808360, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Institute of Electrical and Electronics Engineers Inc., pp. 1953-1956, 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Berlin, Germany, 23/06/19. https://doi.org/10.1109/TRANSDUCERS.2019.8808360

A Novel Out-of-Plane Electrothermal Bistable Microactuator. / Zhou, Liang; Xie, Huikai.
2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc., 2019. p. 1953-1956 8808360 (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Xie, Huikai

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N2 - This paper reports an out-of-plane bistable electrothermal microactautor that is comprised of inverted-series-connected (ISC) Cu/W-based multimorphs. S-shaped ISC multimorphs have been previously employed for generating large vertical displacement. In this work, the ISC multimorphs have been engineered into a warped shape via pre-stressed W and unbalanced SiO2 encapsulation layers. Electrothermal bistable actuators based on the warped ISC multimorphs have been fabricated and tested. A bistable vertical displacement of 25 μm has been obtained.

AB - This paper reports an out-of-plane bistable electrothermal microactautor that is comprised of inverted-series-connected (ISC) Cu/W-based multimorphs. S-shaped ISC multimorphs have been previously employed for generating large vertical displacement. In this work, the ISC multimorphs have been engineered into a warped shape via pre-stressed W and unbalanced SiO2 encapsulation layers. Electrothermal bistable actuators based on the warped ISC multimorphs have been fabricated and tested. A bistable vertical displacement of 25 μm has been obtained.

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M3 - Conference contribution

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Zhou L, Xie H. A Novel Out-of-Plane Electrothermal Bistable Microactuator. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII. Institute of Electrical and Electronics Engineers Inc. 2019. p. 1953-1956. 8808360. (2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII). doi: 10.1109/TRANSDUCERS.2019.8808360

A Novel Out-of-Plane Electrothermal Bistable Microactuator

Abstract

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Keywords

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