TY - GEN
T1 - A novel integrated power inductor in silicon substrate for ultra-compact power supplies
AU - Wang, Mingliang
AU - Li, Jiping
AU - Ngo, Khai D.T.
AU - Xie, Huikai
PY - 2010
Y1 - 2010
N2 - A novel silicon-based inductor, power inductor in silicon, or PIiS, has been proposed and experimentally demonstrated. The PIiS is fabricated at wafer level using a silicon molding micromachining technique, in which 200 μm thick copper windings are embedded into a silicon substrate and both sides of the substrate are capped with a polymer-magnetic power composite. Through-silicon vias (TSVs) and copper routings are also added so that a PIiS can be directly used as a surface mountable packaging substrate. A 3x3x0.6 mm3 PIiS with a measured inductance of 390 nH has been fabricated. The Q factor of this PIiS is 10 at 6 MHz. An ultra compact buck converter has been made by surface mounting off-shelf power ICs and capacitors on a PIiS. The buck converter is 3x3x1.2 mm3, which has successfully delivered 500 mA at 1.8V with an 80% efficiency at 6 MHz.
AB - A novel silicon-based inductor, power inductor in silicon, or PIiS, has been proposed and experimentally demonstrated. The PIiS is fabricated at wafer level using a silicon molding micromachining technique, in which 200 μm thick copper windings are embedded into a silicon substrate and both sides of the substrate are capped with a polymer-magnetic power composite. Through-silicon vias (TSVs) and copper routings are also added so that a PIiS can be directly used as a surface mountable packaging substrate. A 3x3x0.6 mm3 PIiS with a measured inductance of 390 nH has been fabricated. The Q factor of this PIiS is 10 at 6 MHz. An ultra compact buck converter has been made by surface mounting off-shelf power ICs and capacitors on a PIiS. The buck converter is 3x3x1.2 mm3, which has successfully delivered 500 mA at 1.8V with an 80% efficiency at 6 MHz.
UR - http://www.scopus.com/inward/record.url?scp=77952233309&partnerID=8YFLogxK
U2 - 10.1109/APEC.2010.5433515
DO - 10.1109/APEC.2010.5433515
M3 - Conference contribution
AN - SCOPUS:77952233309
SN - 9781424447824
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 2036
EP - 2041
BT - APEC 2010 - 25th Annual IEEE Applied Power Electronics Conference and Exposition
T2 - 25th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2010
Y2 - 21 February 2010 through 25 February 2010
ER -