A Novel Architecture for THz-Band Intersatellite Link Service

Buning Tian, Wenqian Shen, Xiang Gao, Yongxin Guo, Jianping An, Xiangyuan Bu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, several available intersatellite link(ISL) architectures are first described. The beam coverage range at azimuth and the maximum scanning angle at elevation of ISL payloads on each satellite are given. A novel architecture for THz-band ISL service is then presented and the coverage properties of ISL payload are introduced.

Original languageEnglish
Title of host publication2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages202-204
Number of pages3
ISBN (Electronic)9781665428194
DOIs
Publication statusPublished - 2021
Event2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021 - Chongqing, China
Duration: 15 Nov 202117 Nov 2021

Publication series

Name2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021

Conference

Conference2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021
Country/TerritoryChina
CityChongqing
Period15/11/2117/11/21

Keywords

  • Sidelobe
  • array arrangement
  • element
  • mobile base station

Cite this

Tian, B., Shen, W., Gao, X., Guo, Y., An, J., & Bu, X. (2021). A Novel Architecture for THz-Band Intersatellite Link Service. In 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021 (pp. 202-204). (2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications, IMWS-AMP 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMWS-AMP53428.2021.9644008