A LTCC band pass filter for wireless applications

Bo Yuan*, Wei Hua Yu, Hou Jun Sun, Xin Lv

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

MCM (Multi-chip Module) is presently the most effective method for realizing the miniaturization of wireless front-end applications. Filter is one of the most important components in the MCM. In this paper, a novel quasi-lumped band pass filter for wireless front-end was designed and fabricated, adopting low-temperature cofired ceramics (LTCC). The BPF circuit is based on the quasi-lumped filter topology and a wideband circuit design method was adopted. The BPF has been simulated and optimized by Ansoft HFSS. The measured results which were tested not only in the normal atmospheric temperature but also in the high and low temperature agree very well with the full-wave electromagnetic designed responses The proposed filter has been realized in a ten layers ceramic substrate, showing promising application potentials in miniaturized wireless front-end.

Original languageEnglish
Title of host publicationProceedings - 2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009
Pages470-472
Number of pages3
DOIs
Publication statusPublished - 2009
Event2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009 - Beijing, China
Duration: 27 Oct 200929 Oct 2009

Publication series

NameProceedings - 2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009

Conference

Conference2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009
Country/TerritoryChina
CityBeijing
Period27/10/0929/10/09

Keywords

  • Band pass filter (BPF)
  • Low-temperature co-fired ceramics (LTTC)
  • Miniaturization
  • Wireless front-end

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