A bandpass filter using LTCC System-on-Package (SOP) Technology

Bo Yuan*, Wei Hua Yu, Hou Jun Sun, Xin Lv

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Citations (Scopus)

Abstract

LTCC System-on-Package (SOP) Technology is presently the most effective method for realizing the miniaturization of wireless front-end applications. In this paper, the development of highly integrated three-dimensional (3-D) filter solutions in multilayer low temperature co-fired ceramic (LTCC) technologies is presented for compact, low-cost wireless frontend modules utilizing system-on-package (SOP) technology. An asymmetrical dumbbell-shaped capacitor and wideband circuit design method was used to improve the filter characteristic. The embedded filter demonstrate an excellent performance (IL < 1 dB, 3dB BW ge; 27% at the centre frequency of 1.3 GHz) and great potential for high level of 3-D integration in wireless system. The BPF circuit is based on the quasi-lumped filter topology and some broadband technology was adopted. It has been simulated and optimized by Ansoft HFSS. The measured results agree very well with the full-wave electromagnetic designed responses.

Original languageEnglish
Title of host publication2009 International Conference on Microwave Technology and Computational Electromagnetics, ICMTCE 2009
Pages257-260
Number of pages4
Edition557 CP
DOIs
Publication statusPublished - 2009
Event2009 International Conference on Microwave Technology and Computational Electromagnetics, ICMTCE 2009 - Beijing, China
Duration: 3 Nov 20096 Nov 2009

Publication series

NameIET Conference Publications
Number557 CP
Volume2009

Conference

Conference2009 International Conference on Microwave Technology and Computational Electromagnetics, ICMTCE 2009
Country/TerritoryChina
CityBeijing
Period3/11/096/11/09

Keywords

  • Band Pass Filter (BPF)
  • Low-Temperature Co-fired Ceramics (LTCC)
  • Miniaturization
  • SOP

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