A 35 GHz reduced-size bandpass filter based on SIW in LTCC technology

Bingyao Liu; Jianming Zhou; Ruobing Liu; Qiong Wu; Kunpeng Zhang

doi:10.1109/ICMTCE.2013.6812391

A 35 GHz reduced-size bandpass filter based on SIW in LTCC technology

Bingyao Liu, Jianming Zhou, Ruobing Liu, Qiong Wu, Kunpeng Zhang

School of Integrated Circuits and Electronics

Beijing Institute of Technology

Research output: Contribution to conference › Paper › peer-review

6 Citations (Scopus)

Abstract

This paper presents a bandpass filter composed of cavities delimited in a Low Temperature Co-fired Ceramic (LTCC) substrate by a periodic lattice of metallic via-holes. Compared with the conventional two dimensional PCB, LTCC technology achieves higher Q factor, higher density, smaller size, and lower cost[1]. I/O coplanar waveguide (CPW) feeds are printed on the top face of the substrate and are suitable for planar circuit integration. EM simulator HFSS is employed in determining and optimizing the physical dimension of the filter. In this paper, a planar four-pole linear phase filter centered at 35 GHz based on substrate integrated waveguide (SIW) is proposed. The filter's fractional bandwidth (FBW) is 10% with insertion loss of -0.65 dB and return loss of -20 dB.

Original language	English
Pages	77-80
Number of pages	4
DOIs	https://doi.org/10.1109/ICMTCE.2013.6812391
Publication status	Published - 2013
Event	2013 3rd IEEE International Conference on Microwave Technology and Computational Electromagnetics, ICMTCE 2013 - Qingdao, China Duration: 27 Aug 2013 → 29 Aug 2013

Conference

Conference	2013 3rd IEEE International Conference on Microwave Technology and Computational Electromagnetics, ICMTCE 2013
Country/Territory	China
City	Qingdao
Period	27/08/13 → 29/08/13

Keywords

Bandpass Filter
LTCC
Resonant Cavity
SIW
metallic post

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10.1109/ICMTCE.2013.6812391

Cite this

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abstract = "This paper presents a bandpass filter composed of cavities delimited in a Low Temperature Co-fired Ceramic (LTCC) substrate by a periodic lattice of metallic via-holes. Compared with the conventional two dimensional PCB, LTCC technology achieves higher Q factor, higher density, smaller size, and lower cost[1]. I/O coplanar waveguide (CPW) feeds are printed on the top face of the substrate and are suitable for planar circuit integration. EM simulator HFSS is employed in determining and optimizing the physical dimension of the filter. In this paper, a planar four-pole linear phase filter centered at 35 GHz based on substrate integrated waveguide (SIW) is proposed. The filter's fractional bandwidth (FBW) is 10% with insertion loss of -0.65 dB and return loss of -20 dB.",

keywords = "Bandpass Filter, LTCC, Resonant Cavity, SIW, metallic post",

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AU - Wu, Qiong

AU - Zhang, Kunpeng

PY - 2013

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AB - This paper presents a bandpass filter composed of cavities delimited in a Low Temperature Co-fired Ceramic (LTCC) substrate by a periodic lattice of metallic via-holes. Compared with the conventional two dimensional PCB, LTCC technology achieves higher Q factor, higher density, smaller size, and lower cost[1]. I/O coplanar waveguide (CPW) feeds are printed on the top face of the substrate and are suitable for planar circuit integration. EM simulator HFSS is employed in determining and optimizing the physical dimension of the filter. In this paper, a planar four-pole linear phase filter centered at 35 GHz based on substrate integrated waveguide (SIW) is proposed. The filter's fractional bandwidth (FBW) is 10% with insertion loss of -0.65 dB and return loss of -20 dB.

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A 35 GHz reduced-size bandpass filter based on SIW in LTCC technology

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