A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography

L. Wu; S. R. Samuelson; J. Sun; W. Lau; S. Choe; B. S. Sorg; K. Jia; H. Xie

doi:10.1109/MEMSYS.2011.5734355

A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography

L. Wu^*, S. R. Samuelson, J. Sun, W. Lau, S. Choe, B. S. Sorg, K. Jia, H. Xie

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

8 Citations (Scopus)

Abstract

This paper reports a miniature optical coherence tomography (OCT) probe and high-resolution 3D OCT imaging results obtained with this probe. The probe is only 2.8-mm in diameter, enabled by a unique high-fill-factor electrothermal MEMS mirror with hidden actuators and a novel wire-bonding-free (WBF) packaging technique. The MEMS mirror has a large mirror aperture of 1 mm with a chip size of only 1.55×1.7×0.5 mm³. The fabricated device achieves large 2-D scan optical angles up to 46° at only 4.8 V. High-resolution 3D OCT imaging results are also demonstrated using this assembled probe.

Original language	English
Title of host publication	2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages	33-36
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2011.5734355
Publication status	Published - 2011
Externally published	Yes
Event	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico Duration: 23 Jan 2011 → 27 Jan 2011

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
Country/Territory	Mexico
City	Cancun
Period	23/01/11 → 27/01/11

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10.1109/MEMSYS.2011.5734355

Cite this

Wu, L., Samuelson, S. R., Sun, J., Lau, W., Choe, S., Sorg, B. S., Jia, K., & Xie, H. (2011). A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011 (pp. 33-36). Article 5734355 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2011.5734355

Wu, L. ; Samuelson, S. R. ; Sun, J. et al. / A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography. 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. 2011. pp. 33-36 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

@inproceedings{4ed1cd1a09b14c89a389a7f61ecb9105,

title = "A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography",

abstract = "This paper reports a miniature optical coherence tomography (OCT) probe and high-resolution 3D OCT imaging results obtained with this probe. The probe is only 2.8-mm in diameter, enabled by a unique high-fill-factor electrothermal MEMS mirror with hidden actuators and a novel wire-bonding-free (WBF) packaging technique. The MEMS mirror has a large mirror aperture of 1 mm with a chip size of only 1.55×1.7×0.5 mm3. The fabricated device achieves large 2-D scan optical angles up to 46° at only 4.8 V. High-resolution 3D OCT imaging results are also demonstrated using this assembled probe.",

author = "L. Wu and Samuelson, {S. R.} and J. Sun and W. Lau and S. Choe and Sorg, {B. S.} and K. Jia and H. Xie",

year = "2011",

doi = "10.1109/MEMSYS.2011.5734355",

language = "English",

isbn = "9781424496327",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "33--36",

booktitle = "2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011",

note = "24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 ; Conference date: 23-01-2011 Through 27-01-2011",

}

Wu, L, Samuelson, SR, Sun, J, Lau, W, Choe, S, Sorg, BS, Jia, K & Xie, H 2011, A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography. in 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011., 5734355, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 33-36, 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011, Cancun, Mexico, 23/01/11. https://doi.org/10.1109/MEMSYS.2011.5734355

A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography. / Wu, L.; Samuelson, S. R.; Sun, J. et al.
2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. 2011. p. 33-36 5734355 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography

AU - Wu, L.

AU - Samuelson, S. R.

AU - Sun, J.

AU - Lau, W.

AU - Choe, S.

AU - Sorg, B. S.

AU - Jia, K.

AU - Xie, H.

PY - 2011

Y1 - 2011

N2 - This paper reports a miniature optical coherence tomography (OCT) probe and high-resolution 3D OCT imaging results obtained with this probe. The probe is only 2.8-mm in diameter, enabled by a unique high-fill-factor electrothermal MEMS mirror with hidden actuators and a novel wire-bonding-free (WBF) packaging technique. The MEMS mirror has a large mirror aperture of 1 mm with a chip size of only 1.55×1.7×0.5 mm3. The fabricated device achieves large 2-D scan optical angles up to 46° at only 4.8 V. High-resolution 3D OCT imaging results are also demonstrated using this assembled probe.

AB - This paper reports a miniature optical coherence tomography (OCT) probe and high-resolution 3D OCT imaging results obtained with this probe. The probe is only 2.8-mm in diameter, enabled by a unique high-fill-factor electrothermal MEMS mirror with hidden actuators and a novel wire-bonding-free (WBF) packaging technique. The MEMS mirror has a large mirror aperture of 1 mm with a chip size of only 1.55×1.7×0.5 mm3. The fabricated device achieves large 2-D scan optical angles up to 46° at only 4.8 V. High-resolution 3D OCT imaging results are also demonstrated using this assembled probe.

UR - http://www.scopus.com/inward/record.url?scp=79953829001&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2011.5734355

DO - 10.1109/MEMSYS.2011.5734355

M3 - Conference contribution

AN - SCOPUS:79953829001

SN - 9781424496327

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 33

EP - 36

BT - 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011

T2 - 24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011

Y2 - 23 January 2011 through 27 January 2011

ER -

Wu L, Samuelson SR, Sun J, Lau W, Choe S, Sorg BS et al. A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. 2011. p. 33-36. 5734355. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2011.5734355

A 2.8-MM imaging probe based on a high-fill-factor MEMS mirror and wire-bonding-free packaging for endoscopic optical coherence tomography

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